Abstract: A device insertable in the ear canal for substance delivery to and/or extraction from the tympanic cavity is described that includes a stationary body having a distal surface, a proximal surface; a movable body having a distal surface and a proximal surface, disposed within the stationary body and free to move relative to the stationary body in response to a pressure difference created in the ear canal; and at least one piercing element having a distal end and a proximal end, disposed in the movable body.

Abstract: The systems and methods of the present disclosure relate to safely coupling and decoupling various solid objects with the use of pressure-sensitive adhesive. In particular, the disclosure relates to methods and systems for delivering vibrational energy to a pressure-sensitive coupled structure, sufficient to decrease coupling strength of the pressure-sensitive adhesive as well as to de couple or reposition the coupled objects.

Abstract: A device for substance delivery to and/or extraction from the tympanic cavity, comprising: a housing, having a distal surface, a proximal surface that is opposite to the distal surface, and a circumscribed surface that connects the distal surface and the proximal surface; at least one piercing element having at least one proximal piercing end and at least one distal piercing end, disposed within the housing in such manner that the at least one distal piercing end is/are generally facing the distal surface of the housing; and a means for flexing the tympanic membrane toward the distal end of the at least one piercing element.

Abstract: A p-type ZnO-based II-VI compound semiconductor layer has silver, potassium and/or gold dopants therein at a net p-type dopant concentration of greater than about 1×1017 cm?3. A method of forming the layer includes using an atomic layer deposition (ALD) technique. This technique includes exposing a substrate to a combination of gases: a first reaction gas containing zinc at a concentration that is repeatedly transitioned between at least two concentration levels during a processing time interval, a second reaction gas containing oxygen and a p-type dopant gas containing at least one p-type dopant species selected from a group consisting of silver, potassium and gold. A concentration of oxygen in the second reaction gas may also be repeatedly transitioned between at least two concentration levels.

Abstract: A light-emitting device, such as a light-emitting diode (LED), includes a substrate including a ZnO-based material, and a structure disposed on a first side of the substrate. The structure includes a plurality of semiconductor layers and an active layer disposed between the plurality of semiconductor layers. The device further includes at least one textured light emission surface arranged to extract at least some light generated within the device.

Abstract: An electromagnetic wavelength filter that allows the transmission of electromagnetic energy within a narrow range of wavelengths while reflecting incident electromagnetic energy at other wavelengths. The filter includes at least one cavity region; and at least two reflectors surrounding the at least one cavity region, at least one of the reflectors being an omni-directional reflector. The omni-directional reflector includes a structure with a surface and an index of refraction variation perpendicular to the surface, and the omni-directional reflector is specifically configured to exhibit high omni-directional reflection for a predetermined range of frequencies of incident electromagnetic energy for any angle of incidence and any polarization.

Abstract: An electromagnetic wavelength filter that allows the transmission of electromagnetic energy within a narrow range of wavelengths while reflecting incident electromagnetic energy at other wavelengths. The filter includes at least one cavity region; and at least two reflectors surrounding the at least one cavity region, at least one of the reflectors being an omni-directional reflector. The omni-directional reflector includes a structure with a surface and an index of refraction variation perpendicular to the surface, and the omni-directional reflector is specifically configured to exhibit high omni-directional reflection for a predetermined range of frequencies of incident electromagnetic energy for any angle of incidence and any polarization.

Abstract: An electronic device package is provided, consisting of reaction bonded silicon nitride structural and dielectric components and conductor, resistor, and capacitor elements positioned with the package structural components. The package consists of a ceramic package base characterized by a dielectric constant less than 6, of reaction bonded silicon nitride, or a heat spreader material. An electrical conductor is positioned on, embedded in, or attached to the package base for making electrical contact to an electronic device supported on the base and in preferred embodiments, a resistor is attached to the package base. The invention also provides package sidewalls connected to the package base, preferably of reaction bonded silicon nitride, and at least one electrical conductor extending to an outside surface of the package sidewalls for making electrical contact to an electronic device supported by the package base.

Abstract: A method of producing electronic device packages is provided, consisting of the steps of shaping a package preform and heating the package preform in a nitrogen-containing atmoshpere to nitride the package preform. The shaped package preform may consist of package base, sidewall, conductor, resistor, or capacitor components. The package base and sidewall components may be formed of silicon powder. The method also accommodates the step of inserting a semiconducting material into the package preform and heating the semiconducting material component along with the package preform. The inserted semiconducting material component may be processed to define active electronic device areas on the component either before or after the step of heating the shaped package preform and inserted semiconducting material component.

Abstract: Soluble gas is introduced in a melt material which is then atomized and rapidly cooled. The cooling drives the gas from solution, further disintegrating the atomized material to an ultra-fine powder. In one embodiment the atomization and rapid cooling are effected using a gas atomization die. Introduction of the soluble gas may be effected by addition of reactive constituents to the melt, for reactively forming such gas. Finer powders with desirable metallurgical properties are formed using a metallic melt.

Abstract: A method for generating an aerosol powder from a melt includes an atomization die having an orifice through which the melt passes to create the powder. In a preferred embodiment, the orifice has a dimension less than 5 millimeters, and may include a heater to prevent freeze-off. The die may be included in a high-temperature probe suitable for immersion on the melt, so that accumulated accretions of powder on the walls of the probe may be melted off by heating the probe.

Abstract: Soluble gas is introduced in a melt material which is then atomized and rapidly cooled. The cooling drives the gas from solution, further disintegrating the atomized material to an ultra-fine powder. In one embodiment the atomization and rapid cooling are effected using a gas atomization die. Introduction of the soluble gas may be effected by addition of reactive constituents to the melt, for reactively forming such gas. Finer powders with desirable metallurgical properties are formed using a metallic melt.

Abstract: An apparatus for generating an aerosol powder from a melt includes an atomization die having an orifice through which the melt passes to create the powder. In a preferred embodiment, the orifice has a dimension less than 5 millimeters, and may include a heater to prevent freeze-off. The die may be included in a high-temperature probe suitable for immersion in the melt, so that accumulated accretions of powder on the walls of the probe may be melted off by heating the probe.