Abstract: In the electron beam lithographic system disclosed herein, a semiconductor wafer to be exposed is carried on an air bearing puck which is, on both sides, supported or located by balanced annular regions of air pressure. These annular supporting regions surround central evacuated regions which are also balanced so that the puck is not subject to large bending forces. Accordingly, the puck can be constructed to light-weight materials facilitating rapid and precise positioning of the semiconducter wafer with respect to an E-beam generating column.