Abstract: A socket assembly is shown as generally including a cover assembly and a base frame assembly. A low insertion force (LIF) package assembly is connectable to the socket assembly and is comprised of a pin assembly, housing a package. The cover assembly includes a socket cover frame array and the base frame assembly includes a socket contact frame array. The cover assembly is spring loadable relative to the base frame assembly to provide a low insertion force application for the package.

Abstract: An electrical connector is provided that includes a dielectric housing having a plurality of slots therein, and a plurality of electrical contacts disposed within at least one of the slots. A plurality of electrical wafers, are each received in one of the plurality of slots. Each wafer has a first edge and a second edge. Some of the plurality of electrical wafers are signal wafers and some of the plurality of wafers are power wafers. Each of the power wafers includes at least one trace and at least one contact pad. The contact pad is sized to mate with a predetermined number of the plurality of contacts to transfer a predetermined amount of current through the trace.

Abstract: A guide module is provided for connecting a primary circuit board and a secondary circuit board to a common backplane circuit board. The module includes a body that has opposed top and bottom surfaces. A locating feature, on one of the body top and bottom surfaces, establishes a stack height for the secondary circuit board with respect to the primary circuit board. The guide module includes a front face defining a plane that is aligned perpendicular to a mating direction of the primary and secondary boards to the backplane board. The locating feature includes a raised fitting that has a centering rib on an outer perimeter thereof. The raised fitting is received in an attachment hole in the secondary circuit board. The locating feature also includes a boss that has an upper surface upon which the secondary circuit board rests when coupled to the primary circuit board. The upper surface of the boss establishes the stack height.