Abstract: Filled, thermoplastic-modified thermosetting polyester resin formulations are provided as encapsulants for microelectronics devices. The polyester encapsulant formulations include either a low profile thermoplastic resin additive or a combination of polyethylene and a low shrink thermoplastic additive. In preferred embodiments the polyester encapsulant formulations are of low viscosity and can be utilized in various pressure molding protocols. The encapsulant matrix is characterized by a low coefficient of thermal expansion, very low shrinkage, low modulus, and good thermal conductivity. Microelectronics devices encapsulated with the polyester resin formulation exhibit good resistance to moisture related and stress-induced failure.

Abstract: A water washable thermally conductive grease useful for thermal coupling of electronic chips and heat sinks in electronic modules comprises a hydrophilic alkylene oxide modified silicone carrier, and up to 90 weight percent of a microparticulate thermally conductive filler. In a preferred embodiment, the thixotropic dielectric composition further comprises an antioxidant and an ionic surfactant to promote wetting/dispersion of the microparticulate filler. The thermally conductive grease is non-corrosive, resistant to shear induced phase destabilization and capable of being washed from module surfaces with aqueous solutions. Substitution of the present hydrophilic based greases for art-recognized solvent washable greases eliminates use of non-aqueous solvents in electronic module processing/reprocessing operations.

Abstract: A water washable thermally conductive grease useful for thermal coupling of electronic chips and heat sinks in electronic modules comprises a hydrophilic liquid polymer carrier, an antioxidant, and up to 90 weight percent of a microparticulate thermally conductive filler. In a preferred embodiment, the thixotropic dielectric composition further comprises an ionic surfactant to promote wetting/dispersion of the microparticulate filler. The thermally conductive grease is non-corrosive, resistant to shear induced phase destabilization and capable of being washed from module surfaces with aqueous solutions. Substitution of the present hydrophilic based greases for art-recognized solvent washable greases eliminates use of non-aqueous solvents in electronic module processing/reprocessing operations.