Abstract: A housing for optical integrated circuits for protecting the circuit from temperature induced stresses has a base and cap and a thermal bed contained therein. The thermal bed has a region for containing the integrated circuit therein, suspended in a thermally conductive grease. At least one heater is affixed to the thermal bed for heating it, and temperature monitoring apparatus is included for supplying signals to a control apparatus for activating the heater when the temperature of the thermal bed falls outside of the operating temperature range.

Abstract: The present invention includes a system for tracing jumpers used in an exchange to cross-connect optical fibers or wires served by the exchange. The system includes an exchange housing receptacles with optically-encoded data associated with each receptacle or a group of receptacles. The optically-encoded data for a receptacle(s) uniquely identifies the physical location of the receptacle from any other receptacle in the exchange. Likewise, the jumpers each have optically-encoded data formed thereon that uniquely identifies the jumper or jumper end and distinguishes the jumper from any other jumper used in the exchange. If no jumper is to be connected to a particular receptacle, a cover with optically-encoded data can be attached to a receptacle to indicate that no jumper is connected to the receptacle.

Abstract: The invention includes an interconnection assembly for coupling optical fibers to respective optical waveguides of an optical integrated circuit (OIC). The interconnection assembly includes an OIC assembly preferably formed by adhering a protective plate to a substrate on which the OIC and its optical waveguides are integrated. In one end of the OIC assembly, ends of the optical waveguides are exposed. Importantly, the protective plate and the substrate have substantially similar thermal coefficients of expansion to reduce or eliminate stresses or strains on the adhesive when the interconnection assembly is subjected to temperature and/or humidity conditions that are different from those under which the interconnection assembly was formed. The interconnection assembly also includes an optical fiber array that houses end portions of the optical fibers.

Abstract: This invention is directed to a apparatus for coupling an optical fiber end holder at houses an end portion of one or more optical fibers in a spaced arrangement, to respective optical waveguides coupled to an optical integrated circuit (OIC) housed in an OIC unit. The apparatus includes a bridge member situated to extend across an interface between end surfaces of the holder and the unit. The apparatus also includes a shim layer with a first side that contacts the bridge member and a second side that contacts portions of the holder and the unit adjacent their respective ends surfaces. The shim layer, when in its uncured, liquid state, allows the ends of the optical fibers and the optical waveguides exposed in the ends surfaces of the holder and unit, respectively, to be aligned.