Abstract: The present disclosure describes an assembly which has particular application in the testing of printed circuit boards. More specifically, the assembly is comprised of an apertured holding plate which is registered with the board under test, and a probe subassembly. The latter includes a body member having a spring-actuated plunger type probe and a hook-like member. In operation, the body member is advanced toward the plate and the probe and hook-like member enter respective plate apertures. As electrical contact is made by the probe with a desired test location on the board, the hook-like member locks the body onto the plate. The body member is so formed that subsequent pressure applied thereto will release it from its locked condition.

Abstract: The present invention describes an extraction device for removing components, such as leaded integrated circuit packages, from a printed circuit board to which their leads are soldered. The device, under operator control, is designed to captivate the component and to apply to it an extraction force which has a predetermined magnitude independent of the operator's judgment. Accordingly, when all of the component solder joints at the printed circuit board have been sufficiently reflowed, the device automatically withdraws the component from the board into itself. Damage to the board or the component as a result of the extraction process is virtually eliminated through the use of the device.

Abstract: A device for handling electronic circuit components, such as integrated circuit packages, and for facilitating the insertion of the pins or leads thereof into corresponding apertures of a printed circuit board. More specifically, an integrated circuit package assembly may comprise a mounted integrated circuit chip, a block-like multi-apertured element for protecting the package leads, and a heat sink member. The present tool, under operation control, captivates the entire package assembly, ejects the protective block prior to package insertion, positions the assembly on the printed circuit board, and inserts the package leads into homologous apertures of the board--the foregoing requiring minimal, if any, physical contact with the assembly by the operator.

Abstract: The present disclosure describes a connector or socket having particular application for LSI/VLSI integrated circuit (IC) packages with cylindrical interface pins. The connector is characterized by the ease with which the IC package may be inserted therein or withdrawn therefrom, despite the large number of pins involved. In achieving this result, the connector utilizes a unique contact design wherein two opposing cantilever type spring members include respective contoured fingers for capturing and firmly holding an IC package pin during normal circuit operation. The connector also incorporates one or more contact release plates, each having a plurality of cam-like apertures operatively positioned with respect to the connector contacts. Actuation of a release plate moves each pair of contact spring members toward each other, thereby opening the area enclosed by the fingers and providing substantially zero force package insertion or withdrawal conditions.

Abstract: The present disclosure describes a dressing finger assembly of advanced design for use on automatic wiring machines. Such machines make solderless wrapped electrical connections on pluralities of planar disposed terminals. A dressing finger is employed to form predetermined wire patterns in conjunction with a wrap tool which makes the actual connection. It has been observed that the design of dressing fingers used in present day machines is such that the insulation of the wire being wrapped may be pinched and cut, thereby necessitating its replacement to avoid electrical shorting. In accordance with the present invention, the assembly comprised of a newly designed finger and supporting guide, provide the required retention and support of the wire during wrapping while eliminating the aforementioned damage to the wire.

Abstract: The present disclosure describes a side-loading wire wrapping assembly comprised of a specially configured bit and sleeve, for use on semi-automatic wiring machines. Such machines are used to make solderless wrapped connections on terminals emanating from a common plane. The wire wrapping assembly in present use on many of such machines consists of a fixed sleeve substantially enclosing a spring-loaded bit. The arrangement necessitates front-loading of the bit by the operator--a procedure which is tedious and time consuming. The present invention obviates these difficulties by converting the fixed-sleeve assembly from front-loading to side-loading. This is accomplished by providing in the sleeve, a wire feed aperture in contiguity with a longitudinal slot and of orienting the former with a widened portion of the slit formed in the bit periphery by the wire receiving bore.

Abstract: The present disclosure describes an unwrap assembly for use on automatic wiring machines. Such machines are employed to make solderless wire-wrapped connections on posts or terminals emanating from the common plane surface of logic cards and the like. For various reasons, such as logic changes or faulty workmanship, the complete or partial removal of the wires wrapped by such machines may be required. The unwrap assembly of the present invention, comprised of a specially designed unwrap tool slidably disposed within a wire coil stripper sleeve and readily mounted between brackets on the wiring machine, performs the removal function in an economical, time-saving and efficient manner.

Abstract: The present disclosure describes an improved side-loading wrap tool or wire wrapping bit for use on semiautomatic wiring machines. The latter are employed to make solderless wrapped connections on terminals emanating from a common plane. In contrast to the wire wrapping bits presently used on the aforementioned machines, the wrapping bit of the present invention retains the wire to be wrapped in a section of the bit which is completely separated from the terminal-receiving aperture thereof. Additionally, the configuration of the wire holding section provides a positive insulation stop and ensures the entrapment of the insulated portion of the wire within the bit in preparation for the wrap cycle.

Abstract: A high density solder tail connector assembly for leadless integrated circuit packages. The plastic connector package includes upper and lower header portions each having a plurality of mating terminal reception channels formed therein. The upper header portion includes probing holes to allow ready testing of integrated circuit packages mounted on the connector assembly. Each channel is designed to receive an inner and an outer type of S-shaped spring-beam contact. Each type of unitary contact includes a contacting portion, a generally S-shaped spring-beam portion, a probe portion, a base portion, and a solder tail or wire-wrap portion. The two types of contacts differ with respect to the location of the solder-tail portion.

Abstract: The present disclosure describes an improved dressing finger for use with automatic wiring machines. Such machines are used to make solderless wrapped connections on terminals emanating from a common plane. The dressing finger which is used to form predetermined wire patterns is associated with a wrap tool which makes the actual connection. In present day machines, the distance relationship between wrap tool and dressing finger is fixed in one axis and the terminal grid arrangement which is dependent thereon is likewise fixed. The dressing finger of the present invention permits a combination of grids or fixed grids within a predetermined range, thereby providing greater flexibility in the design of the terminal panel.

Abstract: A connector or receptacle is described for connecting a leadless integrated circuit package to an interconnection medium such as a printed circuit board without the need for soldering connections. A significant feature of the connector is that all of its electrical contacts may be engaged or probed individually or collectively from the package side of the interconnection board for diagnostic and test purposes. Probe means suitable for use with the connector are also described.

Abstract: A system is described which provides for high density packaging of electronic equipment, particularly data processing systems. Subnanosecond integrated circuits of the LSI or MSI type in pluggable packages are adapted to be installed in receptacles or connectors. A cooling frame is provided which supports the package connectors as well as the package-to-package interconnection medium. In accordance with the system, groups of integrated circuit packages logically partitioned into functional elements and having, for example, gate complexities of the order of four thousand to ten thousand gates, comprise an island. The system may be expanded further by interconnecting several islands.

Abstract: A fixture for interfacing electrical leads with the terminal edges of a printed circuit card, having a frame for supporting the card, a fixed connector for receiving one of the card's terminal edges and a movable connector slidably mounted on the frame and responsive to the operation of an actuating member for mating with the card's second terminal edge while simultaneously forcing mating of the fixed connector and first terminal edge. As mating occurs, resilient fingers mounted in conjunction with the second connector and previously cammed away from the card engage apertures in the card. These fingers serve to extract the card from the fixed connector when the movable connector is actuated away from the fixed connector toward a stop. At the stop, the fingers are cammed out of the apertures, and the progression of the card is halted while the movable connector continues its motion and thereby decouples from the then stationary second terminal edge.