Abstract: A copper substrate for use as a contact having tin plating, nickel plating and gold plating overlying the substrate. A combination of tin plating is applied over a copper substrate; nickel plating is applied over the tin plating; and gold plating is applied over the nickel plating to form a stack. The stack is then processed by a vapor phase tin reflow step that results in the formation of intermetallics and eliminates stannous oxide layers that may otherwise form on the tin layer. The intermetallic layers provide excellent corrosion resistance, and serve as diffusion barriers to prevent the further migration of either nickel atoms or copper atoms into the tin, and tin atoms outwardly into either the nickel or the copper. Regardless of the thickness, the interfaces are substantially free of oxides, in particular tin oxide, and not prone to delamination.

Abstract: A copper substrate for use as a contact having Sn plating, nickel plating and Au plating overlying the substrate. A combination of Sn plating is applied over a copper substrate; nickel plating is applied over the Sn plating; and Au plating is applied over the nickel plating to form a stack. The stack is then processed by a vapor phase Sn reflow step that results in the formation of intermetallics and eliminates stannous oxide layers that may otherwise form on the tin layer. The intermetallic layers provide excellent corrosion resistance, and serve as diffusion barriers to prevent the further migration of either Ni atoms or Cu atoms into the Sn, and Sn atoms outwardly into either the Ni or the Cu. Regardless of the thickness, the interfaces are substantially free of oxides, in particular tin oxide, and not prone to delamination.

Abstract: An electrical conductor has a metal substrate. A seal layer is provided exterior of the metal substrate. A nickel layer is provided exterior of the seal layer. The seal layer is a non-nickel based metal. Optionally, the seal layer may be tin based. Optionally, the seal layer may create intermetallic interface layers with the nickel layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.

Abstract: Plated contacts and processes of manufacturing plated contacts are disclosed. The processes include providing a metallic substrate, applying tin-containing plating over the metallic substrate, applying corrosion-prevention plating over the first tin-containing plating, applying a second tin-containing plating over the first corrosion-prevention plating, applying a second corrosion-prevention plating over the second tin-containing plating, and applying a gold plating over the second corrosion-prevention plating to form the plated contact. One or both of the first corrosion-prevention plating and the second corrosion-prevention plating includes nickel, a nickel-based alloy, copper, a copper containing alloy, or a combination thereof.

Abstract: A copper substrate for use as a contact having Sn plating, nickel plating and Au plating overlying the substrate. A combination of Sn plating is applied over a copper substrate; nickel plating is applied over the Sn plating; and Au plating is applied over the nickel plating to form a stack. The stack is then processed by a vapor phase Sn reflow step that results in the formation of intermetallics and eliminates stannous oxide layers that may otherwise form on the tin layer. The intermetallic layers provide excellent corrosion resistance, and serve as diffusion barriers to prevent the further migration of either Ni atoms or Cu atoms into the Sn, and Sn atoms outwardly into either the Ni or the Cu. Regardless of the thickness, the interfaces are substantially free of oxides, in particular tin oxide, and not prone to delamination.

Abstract: A nickel based alloy coating and a method for applying the nickel based alloy as a coating to a substrate. The nickel based alloy comprises about 0.1-15% rhenium, about 5-55% of an element selected from the group consisting of cobalt, iron and combinations thereof, sulfur included as a microalloying addition in amounts from about 100 parts per million (ppm) to about 300 ppm, the balance nickel and incidental impurities. The nickel-based alloy of the present invention is applied to a substrate, usually an electro-mechanical device such as a MEMS, by well-known plating techniques. However, the plating bath must include sufficient sulfur to result in deposition of 100-300 ppm sulfur as a microalloyed element. The coated substrate is heat treated to develop a two phase microstructure in the coating.

Abstract: An electrical conductor has a metal substrate. A seal layer is provided exterior of the metal substrate. A nickel layer is provided exterior of the seal layer. The seal layer is a non-nickel based metal. Optionally, the seal layer may be tin based. Optionally, the seal layer may create intermetallic interface layers with the nickel layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.

Abstract: An electrical conductor has a metal substrate. A seal plating layer is provided on and exterior of the metal substrate. A nickel plating layer is provided on and exterior of the seal plating layer. A gold plating layer is provided on and exterior of the nickel plating layer. The seal plating layer is a non-nickel based metal. Optionally, the seal plating layer may be tin based. Optionally, the seal plating layer may create intermetallic interface layers with the nickel plating layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.

Abstract: An electrical connector is provided for mating with an electrical component. The connector includes a substrate having a mating side, and a solder column extending from the mating side of the substrate. The solder column includes a base that is engaged with the substrate. The solder column extends a length away from the mating side of the substrate to a tip. The tip includes a contact surface that is configured to engage and electrically connect to an electrical contact of the electrical component. The solder column is linearly tapered along at least a portion of the length from the base to the tip.

Abstract: An electrical conductor has a metal substrate. A seal plating layer is provided on and exterior of the metal substrate. A nickel plating layer is provided on and exterior of the seal plating layer. A gold plating layer is provided on and exterior of the nickel plating layer. The seal plating layer is a non-nickel based metal. Optionally, the seal plating layer may be tin based. Optionally, the seal plating layer may create intermetallic interface layers with the nickel plating layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.

Abstract: An interposer includes a substrate having a first surface and a second surface with vias extending between the first and second surfaces. The interposer also includes a contact array mounted to the first surface that has a plurality of coil-shaped contacts. The contacts have heels terminated to corresponding vias. The contacts have beams defining a mating interface of the interposer configured for mating with an electronic component. The contacts may be conic helix shaped. The beams may include at least one turn. The beams may be free standing from the heel and may be compressible along contact axes toward the first surface of the substrate.

Abstract: An electrical connector is provided for mating with an electrical component. The connector includes a substrate having a mating side, and a solder column extending from the mating side of the substrate. The solder column includes a base that is engaged with the substrate. The solder column extends a length away from the mating side of the substrate to a tip. The tip includes a contact surface that is configured to engage and electrically connect to an electrical contact of the electrical component. The solder column is linearly tapered along at least a portion of the length from the base to the tip.

Abstract: A system for manufacturing electrical components includes a reflow chamber having an inlet port and an outlet port. The inlet port receives a web of interconnected electrical components having a conductive coating into the reflow chamber. The outlet port discharges the web from the reflow chamber. The reflow chamber directs the web of interconnected electrical components along a predetermined pathway through the reflow chamber. The reflow chamber retains a heated and saturated vapor to heat the conductive coating as the web passes along the pathway through the chamber to reflow the conductive coating about the electrical components.

Abstract: A laminated electrical contact strip includes a plurality of electrical contacts. Each electrical contact includes a pair of opposite first and second surfaces extending between a pair of opposite end portions. A pair of first and second dielectric layers are laminated over the plurality of electrical contacts such that the first and second dielectric layers hold the plurality of electrical contacts therebetween. The first dielectric layer is bonded to and covers a portion of the first surface of each of the electrical contacts. The second dielectric layer is bonded to and covers a portion of the second surface of each of the electrical contacts.

Abstract: A laminated electrical contact strip includes a plurality of electrical contacts. Each electrical contact includes a pair of opposite first and second surfaces extending between a pair of opposite end portions. A pair of first and second dielectric layers are laminated over the plurality of electrical contacts such that the first and second dielectric layers hold the plurality of electrical contacts therebetween. The first dielectric layer is bonded to and covers a portion of the first surface of each of the electrical contacts. The second dielectric layer is bonded to and covers a portion of the second surface of each of the electrical contacts.

Abstract: A method for manufacturing an electrical contact includes providing a series of electrical contacts joined on a carrier strip to a plating station followed by an induction heating station. At the plating station, plating the electrical contacts with a conductive alloy coating to form coated electrical contacts. At the induction heating station, induction heating the coated electrical contacts.

Abstract: A method and apparatus are provided in accordance with embodiments of the present invention for heat-treating electrical contacts. The method and apparatus include plating a core wire with at least one conductive coating to form an electrical contact that experiences internal stresses. The method and apparatus further include induction heating the electrical contact for a predetermined period of time to at least partially relieve the internal stresses. A plurality of electrical contacts may be mounted on a substrate that is held near induction coils to cause heating. The electrical contacts may be formed with spring shaped bodies that are aligned at a desired orientation within magnetic fields created during induction heating. In accordance with at least one embodiment of the present invention, different portions of each electrical contact may be annealed by different desired amounts.

Abstract: A method and apparatus are provided in accordance with embodiments of the present invention for heat-treating electrical contacts. The method and apparatus include plating a core wire with at least one conductive coating to form an electrical contact that experiences internal stresses. The method and apparatus further include induction heating the electrical contact for a predetermined period of time to at least partially relieve the internal stresses. A plurality of electrical contacts may be mounted on a substrate that is held near induction coils to cause heating. The electrical contacts may be formed with spring shaped bodies that are aligned at a desired orientation within magnetic fields created during induction heating. In accordance with at least one embodiment of the present invention, different portions of each electrical contact may be annealed by different desired amounts.