Abstract: A photovoltaic panel having a photovoltaic module supported by a distributed support frame is described. The distributed support frame may include a support member extending over a back surface of the photovoltaic module. For example, one or more support members may extend laterally from a support hub mounted on the back surface. The distributed support frame may reduce a span length of the photovoltaic module between support locations, and thus, may reduce a likelihood that a module laminate will crack under a design load.

Abstract: A photovoltaic panel having a photovoltaic module supported by a distributed support frame is described. The distributed support frame may include a support member extending over a back surface of the photovoltaic module. For example, one or more support members may extend laterally from a support hub mounted on the back surface. The distributed support frame may reduce a span length of the photovoltaic module between support locations, and thus, may reduce a likelihood that a module laminate will crack under a design load.

Abstract: A photovoltaic panel having a photovoltaic module supported by a distributed support frame is described. The distributed support frame may include a support member extending over a back surface of the photovoltaic module. For example, one or more support members may extend laterally from a support hub mounted on the back surface. The distributed support frame may reduce a span length of the photovoltaic module between support locations, and thus, may reduce a likelihood that a module laminate will crack under a design load.

Abstract: A photovoltaic panel having a photovoltaic module supported by a distributed support frame is described. The distributed support frame may include a support member extending over a back surface of the photovoltaic module. For example, one or more support members may extend laterally from a support hub mounted on the back surface. The distributed support frame may reduce a span length of the photovoltaic module between support locations, and thus, may reduce a likelihood that a module laminate will crack under a design load.

Abstract: Approaches for fabricating spot-welded and adhesive bonded interconnects for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. An interconnect structure is electrically connected to the conductive contact structure. The interconnect structure includes a plurality of protrusions in contact with the conductive contact structure. Each of the plurality of protrusions is spot-welded to the conductive contact structure and is surrounded by an adhesive material.