Abstract: A motion sensor having a sensing ring and electrodes formed on or in a surface region of a substrate, such as a silicon chip. The sensing ring is supported above the substrate by a number of spring members extending radially from a hub, so that the ring has an axis of rotation through the hub. The electrodes are formed to closely surround the ring, with some of the electrodes being adapted to induce vibration in the ring, while others detect angular and radial deflections of the ring. Finally, the spring members are substantially S-shaped with substantially C-shaped first and second portions having different radii of curvature. Configuring the spring members to have two portions of different radii of curvature substantially produces in the sensing ring the elliptical vibration mode shape of an ideal ring.

Abstract: A method for making and vacuum packaging a silicon micromachined motion sensor, such as a gyroscope, at the chip level. The method involves micromachining a trench-isolated sensing element in a sensing chip, and then attaching a circuit chip to enclose the sensing element. Solder bumps serve to attach the circuit chip to the sensing chip, form a hermetic seal to enable vacuum-packaging of the sensor, and electrically interconnect the sensing chip with the circuit chip. Conductive runners formed on the enclosed surface of the circuit chip serve to electrically interconnect the sensing element with its associated sensing structures.