Patents by Inventor George S. Knopf

George S. Knopf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die packaging tub having angularly offset pad-to-pad via structure configured to allow three-dimensional stacking and electrical interconnections among multiple identical tubs
    Patent number: 5585675
    Abstract: A packaging assembly for a plurality of semiconductor circuit chips is comprised of a plurality of stacked tub-configured structures, each tub-configured structure including a floor portion sized to receive and mount thereon a respective semiconductor chip, and a surrounding wall portion having a top surface upon which a first arrangement of tub-to-tub bonding pads is formed and a bottom surface upon which a second arrangement of tub-to-tub bonding pads is formed. The first and second arrangements of tub-to-tub bonding pads are mutually aligned with one another along normals to the top and bottom surfaces of a tub, and an interconnect lead network connects a terminal pad of a respective chip with a respective bonding tub-to-tub bonding pad. Each tub-configured chip mounting architecture has an identically configured pad extension layer associated with the same prescribed bonding pad.
    Type: Grant
    Filed: May 11, 1994
    Date of Patent: December 17, 1996
    Assignee: Harris Corporation
    Inventor: George S. Knopf