Patents by Inventor George W. Chiu

George W. Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and materials for multiplexed collections of functional ligands
    Patent number: 11970785
    Abstract: This invention relates to methods and materials for multiplexed utilization of collections of functional ligands, particularly to methods and materials for selecting for and/or utilizing particular desirable traits of functional ligands in a multiplexed manner, and more particularly to methods and materials for selecting for and/or utilizing particular structural changes of functional ligands in a multiplexed manner.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 30, 2024
    Assignee: BASE PAIR BIOTECHNOLOGIES, INC.
    Inventors: George W. Jackson, Robert Batchelor, Alexander S. Chiu, Rafal Drabek, Deepak Thirunavukarasu, Caitlin Bruns
  • Laminated solder column
    Patent number: 5641990
    Abstract: A method for forming solder balls and an apparatus and method for forming solder columns on the electrical contact pads of an electronic package in order to establish a more reliable electrical and mechanical connection between an electronic package and a printed circuit board. In one embodiment, solder balls are formed on the electrical contact pads of a package by placing solder cylinders over the electrical contact pads and then passing the package through a reflow furnace where the solder cylinders take the form of spheres and are wetted onto the pads. In a second embodiment, a laminated solder column is formed that is resistant to collapse during the manufacturing process. The laminated solder column comprises a solder cylinder being clad on its top and bottom surfaces with a solder material having a lower melting temperature than that of the center solder cylinder.
    Type: Grant
    Filed: August 7, 1995
    Date of Patent: June 24, 1997
    Assignee: Intel Corporation
    Inventor: George W. Chiu
  • Method and apparatus for forming solder balls and solder columns
    Patent number: 5542174
    Abstract: A method for forming solder balls and an apparatus and method for forming solder columns on the electrical contact pads of an electronic package in order to establish a more reliable electrical and mechanical connection between an electronic package and a printed circuit board. In one embodiment, solder balls are formed on the electrical contact pads of a package by placing solder cylinders over the electrical contact pads and then passing the package through a reflow furnace where the solder cylinders take the form of spheres and are wetted onto the pads. In a second embodiment, a laminated solder column is formed that is resistant to collapse during the manufacturing process. The laminated solder column comprises a solder cylinder being clad on its top and bottom surfaces with a solder material having a lower melting temperature than that of the center solder cylinder.
    Type: Grant
    Filed: September 15, 1994
    Date of Patent: August 6, 1996
    Assignee: Intel Corporation
    Inventor: George W. Chiu