Abstract: A package of adhesive pads for use on corns, callouses and the like is provided in the form of a sheet of pad material such as moleskin and a relatively thin sheet of plastic adhered thereto. Both sheets are die cut along a plurality of lines to form a plurality of pad elements. The lines of cut are interrupted to provide localized frangible connections between adjacent pad elements to permit the user to remove a selected element by breaking its connections to adjacent elements.