Abstract: A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to prevent die rotation during solder reflow. The at least one solder stop is non-wetting, during a solder reflow process, to solder used to mount the die.

Abstract: A power module having a lead frame with a plurality of power switching devices and a plurality of driving devices mounted thereon. The driving devices control the power switching devices to provide power to a plurality of output leads via first wire bonds. The first wire bonds are substantially parallel to each other between the power switching devices and the output leads. Each power switching device preferably includes a power semiconductor device and a diode, the diodes and power switching devices being interconnected by second wire bonds which are also substantially parallel to each other. The power switching devices preferably comprise bare semiconductor die mounted on the lead frame, the lead frame and power switching devices being enclosed in a molded package. The molded package are preferably formed by transfer-molding or injection-molding.