Patents by Inventor George Walker
George Walker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8980568Abstract: The present invention recognizes that diagnosis and prognosis of many conditions can depend on the enrichment of rare cells, especially tumor cells, from a complex fluid sample such as a blood sample. In particular, the present invention is directed to methods and compositions for detecting a non-hematopoietic cell, e.g., a non-hematopoietic tumor cell, in a blood sample via, inter alia, removing red blood cells (RBCs) from a blood sample using a non-centrifugation procedure, removing white blood cells (WBCs) from said blood sample to enrich a non-hematopoietic cell, if any, from said blood sample; and assessing the presence, absence and/or amount of said enriched non-hematopoietic cell.Type: GrantFiled: October 31, 2005Date of Patent: March 17, 2015Assignee: Aviva Biosciences CorporationInventors: Ping Lin, Douglas T. Yamanishi, Paul G. Hujsak, Sara F. Snyder, George Walker, Junquan Xu, Mingxian Huang, Guoliang Tao, Lei Wu, Xiaobo Wang, Joe Ouyang, Charina Schmitigal, Jing Cheng, Elizabeth Kwok, Jia Xu
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Patent number: 8969021Abstract: The present invention recognizes that diagnosis and prognosis of many conditions can depend on the enrichment of rare cells, especially tumor cells, from a complex fluid sample such as a blood sample. In particular, the present invention is directed to methods and compositions for detecting a non-hematopoietic cell, e.g., a non-hematopoietic tumor cell, in a blood sample via, inter alia, removing red blood cells (RBCs) from a blood sample using a non-centrifugation procedure, removing white blood cells (WBCs) from said blood sample to enrich a non-hematopoietic cell, if any, from said blood sample; and assessing the presence, absence and/or amount of said enriched non-hematopoietic cell.Type: GrantFiled: September 13, 2013Date of Patent: March 3, 2015Assignee: AVIVA Biosciences CorporationInventors: Ping Lin, Douglas T. Yamanishi, George Walker, Junquan Xu, Mingxian Huang, Guoliang Tao, Lei Wu, Xiaobo Wang, Joe Ouyang, Jing Cheng, Jia Xu
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Publication number: 20140073536Abstract: The present invention recognizes that diagnosis and prognosis of many conditions can depend on the enrichment of rare cells, especially tumor cells, from a complex fluid sample such as a blood sample. In particular, the present invention is directed to methods and compositions for detecting a non-hematopoietic cell, e.g., a non-hematopoietic tumor cell, in a blood sample via, inter alia, removing red blood cells (RBCs) from a blood sample using a non-centrifugation procedure, removing white blood cells (WBCs) from said blood sample to enrich a non-hematopoietic cell, if any, from said blood sample; and assessing the presence, absence and/or amount of said enriched non-hematopoietic cell.Type: ApplicationFiled: September 13, 2013Publication date: March 13, 2014Inventors: Ping LIN, Douglas T. YAMANISHI, George WALKER, Junquan XU, Mingxian HUANG, Guoliang TAO, Lei WU, Xiaobo WANG, Joe OUYANG, Jing CHENG, Jia XU
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Publication number: 20130266490Abstract: The present invention includes biochips for the measurement of cellular ion channels and methods of use and manufacture. The biochips of the present invention have enhanced sealing capabilities provided in part by chemically modifying the surface of the biochip surface or substrate or by exposure to an ionized gas. The present invention also includes novel cartridges for biochips.Type: ApplicationFiled: March 13, 2013Publication date: October 10, 2013Applicant: AVIVA BIOSCIENCES CORPORATIONInventors: Antonio GUIA, George WALKER, Jia XU, Julian YUAN, Lei WU, Mingxian HUANG
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Publication number: 20090209029Abstract: The present invention includes biochips for the measurement of cellular ion channels and methods of use and manufacture. The biochips of the present invention have enhanced sealing capabilities provided in part by chemically modifying the surface of the biochip surface or substrate or by exposure to an ionized gas. The present invention also includes novel cartridges for biochips.Type: ApplicationFiled: September 18, 2008Publication date: August 20, 2009Inventors: Antonio Guia, George Walker, Mingxian Huang, Abdelleh Menikh, Lei Wu, Sithiphong Khachonesin, Julian Yuan, Jia Xu
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Publication number: 20090139248Abstract: Disclosed is a device for the transport of temperature sensitive products including an insulated container, an insulated lid, a fastener to secure the lid to the container, an active heat exchanger, a thermal circuit to circulate heat exchange, a temperature sensor read by a temperature regulating circuit that maintains a temperature range, a power source, and a support frame that arranges the elements of the device with the overall center of mass at a location adapted for transport and storage of the device. Disclosed is also a method of transport for temperature sensitive products including securing the temperature sensitive product within an insulated container with a lid, removing heat from the container to maintain a temperature range, strapping the device onto the user's back and adjusting to the shape of the user, freeing both hands during transport of the device, and minimizing hindrances to user mobility caused by the device.Type: ApplicationFiled: November 24, 2008Publication date: June 4, 2009Inventors: ETHAN J. CRUMLIN, GEOFF BECKER, SHAUNA JIN, AMY LAI WONG, NATHAN BARKER BALL, GABRIEL NESTOR SANCHEZ, DANIEL GEORGE WALKER, CHRISTOPHER PAUL POSSINGER, OLUMUYIWA ONI, EMILY SMITH, KABIR JAMES MUKADDAM, MYRAIDA A. VEGA GONZALEZ
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Publication number: 20080106872Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 8, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080106283Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 8, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080106291Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer forms or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer.Type: ApplicationFiled: October 31, 2007Publication date: May 8, 2008Inventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080106282Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 8, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080106285Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 8, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080106284Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 8, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080106281Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 8, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080100324Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 1, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080100316Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 1, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080100318Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 1, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080100317Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 1, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080047741Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: February 28, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080048690Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: February 28, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080048697Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: February 28, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker