Abstract: A component carrier tape used for storing and transporting components, wherein the carrier tape comprises a single layer elongated flexible strip portion having properties suitable for storing and transporting a plurality of components. The single layer strip portion comprises a layer of thermoplastic polymeric foam and has a first surface, a second surface opposite the first surface, and a plurality of openings spaced along the strip portion and extending through the strip portion between the first and second surfaces for receiving the plurality of components. The carrier tape further includes a bottom strip bonded to the second surface of the strip portion, extending along the strip portion, and covering at least a portion of the plurality of spaced openings. The carrier tape may further include a top cover tape realeasably secured to the first surface of the strip portion, extending along the strip portion, and covering at least a portion of the plurality of spaced openings.

Abstract: A semiconductor wafer processing tape comprises a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing. Optionally, the adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber or a photocrosslinking agent. The tapes are useful for both wafer grinding and wafer dicing applications. A method of processing semiconductor wafers is disclosed.

Abstract: A flexible carrier tape for storage and delivery of components by an advancement mechanism, comprises a strip portion, a plurality of aligned pockets spaced along the strip portion for carrying the components, wherein each pocket includes a bottom wall, and a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the bottom wall of the pocket for retaining a component in the pocket.

Abstract: A flexible carrier tape for storage and delivery of components by an advancement mechanism, comprises a strip portion, a plurality of aligned pockets spaced along the strip portion for carrying the components, wherein each pocket includes a bottom wall, and a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the bottom wall of the pocket for retaining a component in the pocket.

Abstract: A carrier tape comprising a strip of flexible material having a series of spaced through openings and a predetermined thickness, the size of the openings and the predetermined thickness being adapted to receive a component between the major surfaces of said strip. The strip of flexible material comprises a layer of nonwoven thermoplastic polymeric fiber adhered together and has in the range of 20 to 70 percent air filled open spaces between the fibers.

Abstract: A carrier tape comprising a strip of flexible material having a series of spaced pockets and a predetermined thickness, the size of the pockets and the predetermined thickness being adapted to receive a component between the major surfaces of said strip. In a preferred embodiment the pockets have at least a substantially closed base portion which lies between the major surfaces of the strip. The strip of flexible material comprises a layer of nonwoven thermoplastic polymeric fiber adhered together and has in the range of 20 to 70 percent air filled open spaces between the fibers. The strip of flexible material may also be composed of a thermoplastic foam.

Abstract: A shoe ground strap which has a static dissipative exposed surface and offers protection against static charges building on the wearer and offers protection against electrical hazards if contacting a source of electrical power. The strap comprises a band comprising a conductive metal ribbon, a static dissipative material and an adhesive layer to aid in holding the strap to the shoe, with at least the surface and the two edges of the band covered by said static dissipative material to expose only the static dissipative material.