Abstract: A power electronics module includes a semiconductor element and a support with a functional surface for indirectly connecting to the semiconductor element. A palladium barrier layer is formed directly or indirectly on the functional surface, and the semiconductor element is directly or indirectly connected to the barrier layer face facing away from the functional surface by a layer of sintering silver paste. A silver layer is can be formed on the barrier layer, and a nickel layer can be formed between the functional surface and the barrier layer.

Abstract: An electrical contact element includes a base body and a coating covering the base body at least in sections. The coating includes an inner layer and an outer layer. The inner layer is applied to the base body and the outer layer is applied to the inner layer and forms a surface at least in sections of the electrical contact element. The inner layer is made of tin and the outer layer of silver, and the outer layer has a thickness of 50 nm-5.0 ?m.