Abstract: The system includes a heat sink member which is permanently attached to a semiconductor integrated circuit which is part of an integrated circuit board assembly, which in turn is part of an electronic equipment unit. A mounting member is positioned in the equipment chassis, adjacent to the integrated circuit board assembly, the mounting member having two spaced openings therein through which inwardly curved end portions of a spring clip extend. The end portions are adapted to conveniently and readily receive and release the heat sink in a low thermal resistance relationship. Hence, individual circuit boards my be removed from the equipment and replaced, without disturbing the desired thermal conductivity between the integrated circuit on the board and the equipment chassis. When the heat sink is operatively received by the end portions of the clip, heat is conducted away from the semiconductor junctions in the integrated circuit to the ambient air outside of the equipment chassis.

Abstract: The connection element includes a plurality of spring contact assemblies for receiving and making electrical contact with printed circuit boards inserted thereinto, respectively wherein the connection element is configured to mate between a side wall portion of the equipment chassis and an end cover thereof, which are secured together with said connection element captured therebetween, wherein insertion of a printed circuit board into a spring contact assembly results in an electrical ground connection between a circuit ground on the circuit board and the equipment chassis.

Abstract: The heat sink assembly includes a heat sink member with a body portion and an upper mounting portion. The heat sink member is connected to an integrated circuit on a printed circuit board assembly. A resilient mounting assembly is positioned on the mounting portion of the heat sink assembly and is constructed and arranged to permit the heat sink assembly to be removably mounted on the mounting member, which in turn is attachable to or part of the chassis of the electronic equipment. The mounting assembly includes a bias element, such as a spring, for holding the heat sink assembly and the mounting member together in a low thermal resistance relationship.

Abstract: A precision-rolling process for producing rolled stock in bar or wire form while maintaining tight shape and size tolerances is characterized, for the purpose of providing good accessibility to the roll stands, by the combination of the following features: rolling of the stock in at least one two-high roll stand with an open pass, starting from any desired cross section, to form rolled stock which is polygonal, in particular tetragonal, in cross section, guiding the rolled stock over a predetermined distance along one or more longitudinal edges and/or along those surfaces of the rolled stock which adjoin longitudinal edges, to a further roll stand, and subsequent rolling to form rolled stock which is circular in cross section in at least one closed pass, in which rolling forces act on and deform the rolling stock in a star shape from at least three directions.