Abstract: A sensor element, a sensor arrangement, and a method for manufacturing a sensor element and a sensor arrangement are disclosed. In an embodiment, a sensor element includes a ceramic main body having at least one electrode arranged at the main body and having at least one contact piece for the electrical contacting of the electrode, wherein the contact piece is fastened to the electrode by welding or bonding.

Abstract: A sensor element, a sensor arrangement, and a method for manufacturing a Sensor element are disclosed. In an embodiment, a sensor element includes a ceramic main body and at least one electrode arranged at the main body, wherein the electrode has at least one layer comprising nickel.

Abstract: The invention relates to a temperature probe comprising two first ceramic plates, a second ceramic plate arranged between the first ceramic plates, and two third ceramic plates. Each of the two first ceramic plates comprises an opening in each in which an NTC sensor element is arranged. An electrode is arranged between the second ceramic plate and each of the first ceramic plates. The first and the second ceramic plates are arranged between the two third ceramic plates. An electrode is arranged between each third ceramic plate and a first ceramic plate. Each electrode electrically contacts an NTC sensor element. Each NTC sensor element is enclosed by ceramic plates. The first, the second and the third ceramic plates and the NTC sensor elements are sintered to form a ceramic body. The invention further relates to a method for producing a temperature probe.

Abstract: The invention relates to a temperature sensor system comprising a first ceramic housing part comprising a sleeve-shaped lower part with a first lower end having a first opening, and a second upper end having a second opening, and an upper part connected to the second upper end. The temperature sensor system further comprises a temperature probe element which is at least partially arranged in the lower part and which has a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical supply lines. The sensor element housing is at least partially arranged in the first opening. The ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. Also disclosed is a method for producing a temperature sensor system.

Abstract: The invention relates to a temperature probe which comprises a functional ceramic probe element and a ceramic housing. The probe element is mounted in the ceramic housing so that at a face of the probe element has direct and form-fitting contact with the ceramic housing. The invention further relates to a method for producing a temperature probe.

Abstract: A sensing device for detecting a physical quantity includes a molded part and a sensor element in the molded part. The sensor element includes an enclosure that is formed from the molded part and an injection-molding compound. A connection element may be connected to the sensor element. An interface may be between the sensor element and the connection element.

Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.

Abstract: A composite material 1 for temperature measurement is specified, as is a temperature sensor 10 formed from the composite material 1. Additionally specified are processes for producing the composite material 1 and for producing the temperature sensor 10.

Abstract: An apparatus includes a main body having an electrode and a contact element. The contact element is directly mechanically and electrically conductively connected to the electrode in order to form an electrical connection between the main body and the contact element. The electrical and mechanical connection between the electrode and the contact element is free of melting regions of the materials of the electrode and of the contact element that are involved in the connection. Furthermore, the connection is realized in a manner free of connection material, for example, in a manner free of solder material.

Abstract: A ceramic component includes a ceramic main body having at least one metallization on at least one exterior surface of the main body and at least one electric inlet lead in electrical contact with the metallization, and an inner protective layer and an outer protective layer that encapsulates the component, wherein the inner protective layer includes at least one material selected from the group consisting of phosphonates (SAMP), silanes, Parylenes and combinations thereof, and the inner protective layer a) contains at least first functional groups via which covalent chemical bonding to at least the ceramic main body is effected and/or b) has been deposited by chemical vapor deposition.

Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.

Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.

Abstract: A ceramic multilayered component which includes a layer stack having a plurality of ceramic layers. The multilayered component includes a first and a second connecting contact as well as a first and a second inner electrode, which are each arranged between two layers of the layer stack. The multilayered component includes a first and a second via electrode for electrically coupling the first connecting contact to the first inner electrode and for electrically coupling the second connecting contact to the second inner electrode.

Abstract: A high-temperature sensor element includes at least one thermistor element having at least two contact areas and one contacting element including an isolating ceramic base body and at least two conductor lines. The contact areas of the thermistor element are connected to the conductor lines of the contacting element by an electro conductive bridge. A process for assembling a sensor element is also described in which an thermistor element is connected by a temperature resistant junction to a contacting element, and in which the thermistor element and part of the contacting element adjacent to the thermistor element are sealed by a encapsulation compound.

Abstract: An electrical component is specified with a sensor element, which is embedded in a plate arrangement. The plate arrangement includes at least three plates and conductor tracks, which are located between them and are conductively connected with the sensor element. At least two of the conductor tracks have exposed areas. Furthermore, a method for the encapsulation of a sensor element and a method for the production of a plate arrangement are specified.

Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.

Abstract: A sensor device includes a flexible first film that includes structured conductive traces. The sensor device also includes a probe electrically connected to the structured conductive traces. The probe is on a first surface of the first film and connected to the first surface of the first film. The sensor device also includes a flexible second film conformally surrounding the probe and sealing the probe to the first surface of first film.

Abstract: The invention pertains to a solar sensor that includes a first modulator that is transparent to electromagnetic waves within a spectrum, and an additional modulator that is at best slightly transparent to the electromagnetic waves within the spectrum. The additional modulator features a belt-shaped region of varying widths that is arranged on the outside of the first modulator and partially covers the first modulator, and a photodetector that receives the electromagnetic waves and is covered by the first modulator.

Abstract: A composite material 1 for temperature measurement is specified, as is a temperature sensor 10 formed from the composite material 1. Additionally specified are processes for producing the composite material 1 and for producing the temperature sensor 10.

Abstract: A sensing device for detecting a physical quantity includes a molded part and a sensor element in the molded part. The sensor element includes an enclosure that is formed from the molded part and an injection-molding compound. A connection element may be connected to the sensor element. An interface may be between the sensor element and the connection element.