Abstract: A cooling unit is disclosed for cooling a plurality of spaced-apart circuit boards having elongated edges and disposed within an integrated test cell. The cooling unit includes a supply path for directing a cooled cooling medium between the plurality of circuit boards and in the direction of the elongated edges and a heat exchanger. The heat exchanger is disposed in a substantially vertical relationship above the circuit boards and has an input to receive a heated cooling medium from the circuit boards. The heat exchanger further includes a converter to convert the heated cooling medium to a cooled cooling medium, and an output for discharging the cooled cooling medium. A circulation unit is disposed proximate the heat exchanger output, and is operative to draw the heated cooling medium from between the circuit boards, through the heat exchanger and to recirculate the cooled cooling medium through a recirculation path.