Patents by Inventor Gerald Leap

Gerald Leap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation
    Patent number: 6760981
    Abstract: The invention provides a compact drying chamber for drying printed circuit boards and electronic connectors and components mounted thereto by enhanced evaporation to remove residual water and completely dry printed circuit boards. The compact drying chamber comprises features that help maximize a velocity at which heated air impacts printed circuit boards to significantly enhance evaporation from surfaces of printed circuit boards and to raise the temperature of electronic connectors and components to allow evaporation therefrom, while maintaining low power consumption with respect to heating and circulating air. The compact drying chamber also comprises features that help maximize a dwell time of printed circuit boards in high velocity heated air within practical conveyance speeds, while maintaining overall dimensions that allow a compact design.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: July 13, 2004
    Assignee: Speedline Technologies, Inc.
    Inventor: Gerald Leap
  • Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation
    Publication number: 20030136019
    Abstract: The invention provides a compact drying chamber for drying printed circuit boards and electronic connectors and components mounted thereto by enhanced evaporation to remove residual water and completely dry printed circuit boards. The compact drying chamber comprises features that help maximize a velocity at which heated air impacts printed circuit boards to significantly enhance evaporation from surfaces of printed circuit boards and to raise the temperature of electronic connectors and components to allow evaporation therefrom, while maintaining low power consumption with respect to heating and circulating air. The compact drying chamber also comprises features that help maximize a dwell time of printed circuit boards in high velocity heated air within practical conveyance speeds, while maintaining overall dimensions that allow a compact design.
    Type: Application
    Filed: January 18, 2002
    Publication date: July 24, 2003
    Inventor: Gerald Leap