Abstract: The invention relates to a heat exchange device including at least one heat exchange wall (6) between the refrigerant fluid (3) and the fluid to be cooled (4) having on one side a so-called hot surface (7) in contact with the fluid to be cooled, and at least one mechanical system (10) antagonist to the deposition on the hot surface of the exchange wall, of a solid layer of the fluid to be cooled. According to the invention, the means antagonist to the deposition is formed with a friction means (11) including a planar surface extending parallel to the hot surface of the exchange wall and having a heat conductivity such that the ratio of the heat conductivities of said friction means on the hot surface is larger than or equal to 3, and the mechanical system (10) includes means for supporting the friction means, adapted so that the latter rubs on the hot surface of the exchange wall via its planar surface.

Abstract: The invention relates to a heat exchange device including at least one heat exchange wall (6) between the refrigerant fluid (3) and the fluid to be cooled (4) having on one side a so-called hot surface (7) in contact with the fluid to be cooled, and at least one mechanical system (10) antagonist to the deposition on the hot surface of the exchange wall, of a solid layer of the fluid to be cooled. According to the invention, the means antagonist to the deposition is formed with a friction means (11) including a planar surface extending parallel to the hot surface of the exchange wall and having a heat conductivity such that the ratio of the heat conductivities of said friction means on the hot surface is larger than or equal to 3, and the mechanical system (10) includes means for supporting the friction means, adapted so that the latter rubs on the hot surface of the exchange wall via its planar surface.

Abstract: Hybrid power relay used for opening or closing electrical circuits, including an electrical contact having a mechanical movement, a semiconductor component in parallel with the electrical contact, and a control unit which in response to a logic input level causes the electrical contact to close (open) and the semiconductor component to be turned on. The control unit generates a contact-make signal for closing the contact, and a control signal that turn on the semiconductor component for a predetermined period of time. The control signal prevents the semiconductor component from being turned on after the predetermined period if the electrical contact fails to close so that the semiconductor component is undamaged.