Abstract: The invention concerns a method for the making of chip cards, wherein the entire manufacturing method is carried out on a standard format card, and then a chip card with a smaller format than the standard format is cut out from this card.

Abstract: A chip card comprises a chip card body, a chip, and a connector. The connector has a metal contact which is electrically connected to the chip for communicating electrical signals. The metal contact includes a main layer which is free of etched information elements, and a coating layer which has information elements etched therein. In one improvement, the information elements are laser-etched. In another improvement, the information elements are also marked on the chip card body and are stored in the chip. The present invention advantageously helps protect against the fraudulent interchanging of the chip card micromodule, including the chip and the connector.

Abstract: Disclosed is a method for the marking of particulars on a connector of a card called an electronic chip card, said connector having metal contacts with a given thickness. Said method comprises a step consisting of the etching, with a laser beam, of said particulars in the thickness of the metal contacts of the connector. Application to the marking of chip cards, bank cards, telephone cards etc.

Abstract: Disclosed is a method for the fabrication of chip cards. These cards are flat and undergo a high degree of deformation under bending and twisting stresses, when the user does not take any special precautions in their use. A micromodule is housed in a cavity of the card, and this micromodule is fixed by the natural adhesion between the plastic material of the bottom of the cavity and the coating resin of the integrated circuit of the module. To prevent the micromodule from being torn off during a bending stress undergone by the card, there is provision for at least one overhang by which the upper surface of the card covers an edge of the micromodule to limit the movements of said micromodule.

Abstract: Disclosed is a method for installing an electronic component and its electrical connections on a support provided with a cavity to house said component. A metallic layer is cut out into zones on which there is deposited a layer of polyimide which mechanically holds the said zones during the operations for the electrical connection of the electronic component and for encapsulation and installation on the support. This method avoids the use of a supporting film and of a bonder to fix the metallic joints to the film, namely elements that do not withstand high temperatures during encapsulation.

Abstract: Disclosed is a method for installing an electronic component and its electrical connections on a support provided with a cavity to house said component. A metallic layer is cut out into zones on which there is deposited a layer of polyimide which mechanically holds the said zones during the operations for the electrical connection of the electronic component and for encapsulation and installation on the support. This method avoids the use of a supporting film and of a bonder to fix the metallic joints to the film, namely elements that do not withstand high temperatures during encapsulation.