Abstract: The display screen (11) is made of pixels (P) connected to one edge (11a) of the screen by wires (12) separated by a given pitch (s) so as to be controlled by respective terminals (18) of integrated circuits (16) outside the screen. The terminals (18) of each integrated circuit are disposed in a plurality of parallel rows (19) in which they are separated from one another by a pitch (Sm) equal to several times the pitch of the wires. Each integrated circuit is mounted on a connecting support (10) formed by an insulating film (21) carrying conductive tracks (23) connecting the terminals of the integrated circuit to the corresponding wires of the screen, the tracks extending substantially at the pitch of the wires. The mounting is done simply by collective reflow of bumps between the tracks (23) and the terminals (18), and the support (10) makes it possible to test the integrated circuits before they are mounted on the screen.

Abstract: The invention applies to packages for transmitting signals at very high frequencies. A package (10) for the integrated circuit (11) comprises conductors disposed on at least two levels (N1-N6) and distributed so that two pairs of conductors of two fixed potentials (18d, 18g; 19d, 19g), along with a conductor (18s) for single-pole transmission of a signal, form a three-dimensional structure which is approximately coaxial having a characteristic impedance which is substantially constant and predetermined.

Abstract: A device for mounting a first element onto a second element to sandwich an electrical or electronic component therebetween, wherein the device is operable to cause the first element to exert a contact force on the component when the first element is mounted onto the second element and to couple the device to the first element in a manner which exerts a mounting force on the first element which is independent of whether the first element is mounted onto the second element. The first element may be a heat sink and the second element may be a printed circuit board.

Abstract: An integrated circuit (IC) package (10), having an integrated circuit (11) and a connecting substrate (12) comprising an insulating film (13), one side of which carries conductors (14) and the other side of which carries balls (15) connected to the respective conductors by means of via holes (16) in the film. The balls (15) are fixed directly to said via holes, the base of which is formed by the respective conductors. The balls are preferably made of a remeltable material such as tin lead and the fixation can be made initially by an adhesive substance. The process for connecting two connecting substrates (12, 22) by means of balls (15), one of which substrates comprises a film (13), one side of which is provided with conductors (14) and the other side of which is provided with via holes (16), consists of fixing the balls directly to the conductors in the via holes by remelting the balls. The balls can be soldered or prefixed by an adhesive substance to connecting pads (23) of a board (22).

Abstract: On the TAB package (10) including a TAB spider (13) glued to a preformed substrate (15) and provided with leads (12) the ILB ends of which rest on an insulating frame (20), this frame is an element directly mounted on the leads, which is independent of the substrate and has a thickness substantially less than that of the substrate.

Abstract: A heat sink of a circuit package for high density integrated circuits is fastened by a spring element that has shape memory. The fastening is carried out in a manner so that the element can be easily removed for disassembly.

Abstract: A package (10) for very large scale integrated circuit (VLSI) includes an electrically and thermally conductive tagboard (20) carrying the chip (12); supply terminals (15a) receiving a first supply potential; an interconnect structure (16) made of ceramic which surrounds the chip (12) and carries both the signal terminals (14) of the package (10) and the supply terminals (15b) receiving a second supply potential, the interconnect structure (16) incorporating the signal and supply conductors intended for the chip (12); and a decoupling device (17) including capacitors (19) and two conductor faces (18a, 18b) connected respectively to the supply terminals (15a, 15b). The decoupling by the capicitors (19) is thus done as close as possible to the conductor faces (18a and 18b) and as close as possible to the chip (12) at the level of islets (32a, 32b).

Abstract: A method for mounting an integrated circuit or chip (10) on a printed circuit board (11), the chip package (36) produced thereby, and a tape carrying chips for using the method are proposed. The chip is mounted by fixing its leads (12) on the zones (13) of the board (11) by securing the chip between a support board (15) and a heat dissipating element (14) that are connected with one another by conductive columns (16) to form the package (36). The invention is applicable in particular to manufacture of very large scale integration (VSLI) chips.

Abstract: A device in the form of a contact assembly or package (10) for use in a card (26), such as a credit card. The package includes a substrate (11) having contact holes (16) extending therethrough. The holes are covered by a metal layer (15) on the substrate. Terminals (14) of an integrated circuit (12) are soldered to the metal layer (15) through the holes (16) of the substrate (11). The terminals have a height approximately equal to the thickness of the substrate (11).

Abstract: A support for integrated circuit chips to be mounted on an interconnecting base provided with conductive areas. The support consists of a flexible strip made of an inextensible insulating material having equidistant openings towards the center of each of which extend overhanging interface conductors electrically independent of each other. The free inner ends of the conductors in each opening correspond to that of the contact areas on a chip placed at the center of the opening, and each of the conductors has at a point along its overhanging portion, a contact region which is intended to be soldered to a corresponding conductive area on the said interconnecting base.