Patents by Inventor Gerard Mahoney

Gerard Mahoney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HBT/FET process integration
    Patent number: 7977708
    Abstract: A co-integrated HBT/FET apparatus and system, and methods for making the same, are disclosed. A co-integrated HBT/FET apparatus may include a first epitaxial structure formed over a substrate, the first epitaxial structure forming, at least in part, a FET device, a separation layer formed over the first epitaxial structure, and a second epitaxial structure formed over the separation layer, the second epitaxial structure forming, at least in part, a heterojunction bipolar transistor (HBT) device.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: July 12, 2011
    Assignee: Triquint Semiconductor, Inc.
    Inventors: Timothy Henderson, Jeremy Middleton, Sumir Varma, Corey Jordan, Gerard Mahoney, Bradley Avrit, Lucius Rivers
  • Microelectronic bond pad
    Publication number: 20070023901
    Abstract: One embodiment of an integrated circuit includes a substrate, an electrical device positioned above the substrate, and a bond bad positioned above and aligned along a vertical axis with the electrical device such that the electrical device is positioned between the substrate and the bond pad.
    Type: Application
    Filed: July 29, 2005
    Publication date: February 1, 2007
    Inventors: Gerard Mahoney, Matthew Essar, Walter Wohlmuth, Wayne Struble