Abstract: A soldering system comprising a solder pot and a nozzle exchange unit. The solder pot is configured to detachably couple to a solder nozzle during a soldering operation. The nozzle exchange unit is arranged to: store a plurality of solder nozzles; detach a first nozzle from the nozzle coupling; and attach a stored second nozzle to the nozzle coupling.

Abstract: A soldering nozzle for directing solder during a multi-wave soldering operation, the soldering nozzle comprising outlets for solder and de-bridging gas. The solder outlet dispenses solder therefrom and receives a plurality of parts to be soldered. The de-bridging gas outlet directs de-bridging gas between a plurality of soldered parts after they exit the solder outlet. A solder pot comprising a soldering nozzle and a de-bridging gas outlet is further disclosed. The de-bridging gas outlet is arranged relative to the soldering nozzle such that de-bridging gas is directed between a plurality of soldered parts after they exit a solder outlet.

Abstract: The present application relates to a reflow soldering oven (1) for soldering an electronic circuit board (300), the oven (1) comprising a gas purification system (11, 21) for purifying gas that contains flux components vaporized from the electronic circuit board (300). The gas purification system further comprises at least one gas purification unit (11, 21) comprising a catalyst unit comprising a catalyst material. The invention further relates to a corresponding reflow soldering method.

Abstract: The present application relates to a reflow soldering oven (1) for soldering an electronic circuit board (300), the oven (1) comprising a gas purification system (11, 21) for purifying gas that contains flux components vaporized from the electronic circuit board (300). The gas purification system further comprises at least one gas purification unit (11, 21) comprising a catalyst unit comprising a catalyst material. The invention further relates to a corresponding reflow soldering method.

Abstract: The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the visually assessed soldered joints that do not meet the relevant quality requirements. The visual assessment takes place by means of a video camera and a computing device connected to the video camera. The assessment criteria for the soldered joints are stored in the computing device. The invention also relates to an apparatus for carrying out the method.

Abstract: The invention relates to a method for soldering an object comprising several soldered joints, which method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the visually assessed soldered joints that do not meet the relevant quality requirements, wherein said visual assessment takes place by means of a video camera and a computing device connected to the video camera, in which computing device the assessment criteria for the soldered joints are stored.

Abstract: The invention relates to an apparatus for visually inspecting soldered joints made on a soldered object, comprising: A camera for recording at least one image of the soldered object on which the soldered joints to be soldered are present, a computing device connected to the camera for receiving the signals from the camera that represent the images recorded by the camera, the computing device being arranged for comparing the signals with signals which are representative of correct soldered joints, and a handling device for moving the soldered objects on which the soldered joints to be inspected have been made to a position within the viewing range of the camera.