Abstract: An ion generator for the generation of a plasma is assembled from module subassemblies. The first subassembly includes a dielectric plate 1, on the first surface 1a of which are located a large number of first electrodes 3, and the second surface 1b of which is coated with a structured conductive layer 2. The second subassembly includes an aperatured spacer plate with a large number of dielectric spacers with a second electrode 5 on the side facing away from the dielectric plate 1. In joining the subassemblies together, the aperatured spacer plate is connected to the dielectric plate 1 at its first surface 1a in such a way that cavities 6 for accommodating plasma are formed by the first electrodes 3, parts of the first surface 1a of the dielectric plate 1 and the spacers 4 with the second electrodes 5. The first set of electrodes 3 shield the points where the subassemblies are bonded together from plasma in the cavities.

Abstract: Described is a method for manufacturing of carrier element modules of a thin carrier element (4) and a thereon mounted semiconductor chip (2). This method renders possible the application of chips (2) with great dimensions (macro-chips) and a wide variety of different types. A chip transfer moulding process is designed so that a minimised height--without the need for reworking--is achievable, and therefore a less costly surface mounting of the chips can be applied. The manufactured module according to the invention can be used as well as in flexible circuit boards (e.g. for cameras) or in chipcards. The method according to the present invention has a first step of putting the at least one IC (2) onto the carrier element (4), a second step of contacting the at least one IC (2) with the carrier element (4) and a third step of transfer moulding a transfer moulding compound (18) to encapsulate the IC (2).

Abstract: A contact probe arrangement for electrical functional testing, including a first stack of perforated plates, a second stack of perforated plates and a plurality of contact probes. The probes are in contact with the second stack of perforated plates, and in communication with the first stack, the probes are arranged and dimensioned such that the probes are capable of lateral buckling and capable of being guided through the first stack. The contact probe arrangement also includes a test card, a counterholding piece attached to the test card, and a pressure plate, the pressure plate movably connected to the test card. The first perforated plate is connected to the second perforated plate such that the first perforated plate is capable of movement toward and away from the second perforated plate and the second perforated plate is connected to the first perforated plate such that the second perforated plate is capable of movement toward and away from the first perforated plate.

Abstract: A disk is described for vertical magnetic data storage, which can be directly contacted by a read/write head, consists of a substrate made of silicon, the surface of which forms a layer of porous silicon. The layer of porous silicon preferably contains pores which run essentially perpendicular to the surface of the substrate and are at least partially filled with a magnetic material. To manufacture the disk, a substrate made preferably of monocrystalline silicon, is chemically treated to form the pores which are at least partially filled with a magnetic material. The magnetic material may be removed from the surface between the pores. The silicon surface may then be treated to improve the wear characteristics. With such a disk, the read/write head can come in direct contact with the treated silicon substrate surface without abrasion or damage.

Abstract: The invention relates to an adhesive bond 1 for a plurality of densely packed elements 4a, 4b, 4c guided into a plate pack 3. At the plate surface 2 with the adhesive bond 1 the guidance holes 5a are made larger than the guidance holes 5b in the remainder of the plate pack (3) and the adhesive bond is effected by means of a highly viscous adhesive. Because of the larger opening 5a, an adhesive reservoir 10 is formed at the plate surface 2. This makes it possible to use high viscosity adhesives. The geometric features and the use of a highly viscous adhesive make it possible to manufacture durable and heat-resistant adhesive bonds for elements such as wires, glass fibers or micromechanical components.

Abstract: A method of automatically forming identically positioned alignment marks on the front side and the back side of a silicon wafer especially prepared for use in silicon micromechanical technology. The front side and the back side of the silicon wafer are coated with an insulating layer. High-energy heavy ions are directed onto the front side insulating layer. The heavy ions penetrate the front side insulating layer, the wafer, and the back side insulating layer, thus forming single disturbed crystal lattice nuclear tracks in both insulating layers, with the wafer remaining undisturbed.The nuclear tracks in both insulating layers are etched so that corresponding identically positioned pores are opened. These pores are used as alignment marks for individual further method steps.

Abstract: Method for measuring the properties of a slider/disk interface in a magnetic disk storage apparatus by measuring a triboelectric current flowing between disk and slider. Rotational speed is adjusted between 100 and 500 rpm so as to obtain a frictional contact between disk and slider. The shape of the tribo current curve obtained during the measuring time interval is analyzed. An early maximum of the tribo current amplitude and a subsequent continual decay indicates a good slider/disk interface and a long lifetime.

Abstract: A magnetic recording disk comprises a magnetic layer consisting of a binder and magnetic particles, a silicon substrate and abrasion-resistant material formed on the silicon substrate. The abrasion-resistant material is in the form of elevations which protrude from the silicon substrate and whose surface is coplanar with the surface of the magnetic layer. The abrasion-resistant elevations are formed on the substrate in a predetermined uniform distribution either after the surface of the substrate has been blanket doped and/or covered with a layer comprising aluminum as a main component, by tempering and optionally oxidizing; or after the surface of the substrate has been selectively doped, by etching off the undoped regions of the surface of the substrate.