Abstract: An apparatus for detecting the breakage of at least one cutting element disposed in a guide includes at least one sliding piece which is linearly displaceable relative to the guide and which can be connected to the cutting element for holding the cutting element. A force applying element is provided to produce a force on the sliding piece so that if the cutting element breaks, the sliding piece is displaced relative to the guide. A sensor detects such a displacement of the sliding piece relative to the guide. A system having the detection device is also provided.

Abstract: An apparatus for cutting a wafer sandwich into a plurality of rectangular pieces has a support surface defining a transport path extending longitudinally through a longitudinal-cutting station and a transverse-cutting station. A plurality of stationary and transversely spaced longitudinal blades extend across the path in the longitudinal-cutting station. The surface is formed in the transverse-cutting station with a plurality of transversely extending and longitudinally spaced slots. An abutment is displaceable immediately downstream of the transverse-cutting station between a blocking position in the path and a retracted position clear of the path. A plurality of transverse blades are displaceable transversely in the slots of the transverse-cutting station across the path.