Abstract: For especially simple and reliable handling of thin and/or bent semiconductor wafers it is proposed in a corresponding holding means (100) that there is a gas flowing through at least one first means (5) for producing the forces which pull a semiconductor wafer toward the means (100) based on the Bernoulli principle and that there is at least one second means (2, 3) for holding the semiconductor wafer on the means (100) as a result of the forces produced by at least one electromagnetic field.