Abstract: A die presentation package exchange system for use in a hybrid die bonder, in particular an automatic hybrid die bonder, which system comprises a magazine (10) for storing a plurality of die presentation packages (12). The system further comprises a clamp assembly (40), adapted to collect a selected die presentation package (12) from the magazine (10) and feed it to a die eject station (204) of the die bonding machine. The clamp assembly (40) is further adapted to retrieve the die presentation package (12) from the die eject station (204) after a predetermined number of dice have been ejected, and return it to the magazine (10). The magazine (10) further comprises indexing structure for indexing movement of the packages (12) within the magazine (10) so that the selected package is located at a collection point for collection from the magazine (10). The system further comprises indexing structure for indexing rotation of the clamp assembly (40) about its axis (62).

Abstract: A die eject system for a hybrid die bonder, in particular an automatic hybrid die bonder, comprises a support, on which a plurality of die eject heads are mounted. The die eject heads can be sequentially indexed into an operative position. The system has the advantage that it is possible to change rapidly from one head to another, either to eject different sizes of dice or in the case of damage to a die eject needle within a die eject head.

Abstract: A hybrid die bonder has the ability to change tool holders to accommodate different die sizes. The single pick up head is selectively, magnetically, connectable to any of a plurality of tool holders. An electromagnet in the head holds a magnetic tool holder and a sealed air line is established therebetween. Prior to pick up, the head and tool holder have the same orientation so that precision locating structure therebetween will cooperate to establish a precise axis for the tool holder.