Patents by Inventor Geun Ryo

Geun Ryo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070075325
    Abstract: The invention relates to a high power LED package having excellent light efficiency and heat dissipating characteristics. The LED package includes a base member, a reflector unit arranged on the base member and having a plurality of first reflectors, a plurality of LED chips mounted on the base member and surrounded by the first reflectors, and a connection unit arranged on the base member, for electrically connecting the LED chips to an outside. The reflector unit also includes a second reflector surrounding the first reflectors. The second reflector is arranged to surround the first reflectors in order to completely prevent any interference of emission lights and collect the emission lights together, thereby enabling excellent light efficiency. Furthermore, with the first reflectors surrounding the individual LED chips, it is possible to maximize heat dissipating efficiency of the lead frame, thereby stabilizing operating characteristics of the package.
    Type: Application
    Filed: October 3, 2006
    Publication date: April 5, 2007
    Inventors: Jong Baek, Je Park, Geun Ryo, Jun Seo, Jung Park
  • Publication number: 20060267040
    Abstract: The present invention relates to a high-brightness LED with a protective function of electrostatic discharge damage. The high-brightness LED with a protective function of electrostatic discharge damage includes a lead frame that is formed with a pair of anode and cathode leads; a package that is formed of synthetic resin and in which a portion of the lead frame is housed; an LED chip that is mounted on the upper surface of the lead frame inside the package; an electrostatic discharge damage protecting element that is mounted on the lower surface of the lead frame inside the package and is connected parallel to the LED chip through a wire; and a molding material that is filled in the package so as to protect the LED chip.
    Type: Application
    Filed: May 31, 2006
    Publication date: November 30, 2006
    Inventors: Jong Baek, Je Park, Geun Ryo, Chang Kim, Jun Seo, Young Song