Abstract: A substrate treatment line is disclosed. The substrate treatment line may include a chamber portion including a plurality of treatment chambers stacked in a vertical direction, and a vertical return robot, including a plurality of gripping portions, to transfer a plurality of substrates in a vertical direction simultaneously and load or unload the substrates to the treatment chambers.

Abstract: A substrate cleaning line and a substrate cleaning system including the same are disclosed. The substrate cleaning line may include a chamber portion including a plurality of cleaning chambers to clean a substrate, and a first return robot to load, unload, or transfer the substrate from or to the plurality of cleaning chambers, wherein the cleaning chambers may be stacked on each other in a vertical direction.

Abstract: A substrate polishing method for polishing a substrate through a polishing pad according to an embodiment may comprise: a preheating step of increasing the temperature of the polishing pad by supplying heated pure water to the polishing pad before polishing the substrate; and a temperature control step of controlling the temperature of the polishing pad by adjusting the temperature of the slurry supplied to the polishing pad in a polishing process of the substrate.

Abstract: A substrate polishing system may include a substrate transfer unit to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit in a circle by a rotational motion, at least one carrier to perform polishing on the substrate received from the substrate transfer unit, and a loader to load the substrate which is seated on the substrate transfer unit to the carrier or unload a substrate placed on the carrier to the substrate transfer unit.

Abstract: A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, and at least one carrier to perform polishing the substrate transferred by the substrate transfer unit.

Abstract: A substrate transferring system may include a first transfer unit to transfer a substrate along a circular first orbit while rotating on a first axis perpendicular to a ground, and a second transfer unit to transfer a substrate along a circular second orbit while rotating on a second axis perpendicular to the ground, wherein the first orbit and the second orbit may overlap with each other at a first point, and at the first point, a substrate may be transferred from the first transfer unit to the second transfer unit or from the second transfer unit to the first transfer unit.

Abstract: A substrate polishing apparatus according to an example embodiment may include a substrate carrier configured to grasp and move a substrate, a polishing pad configured to come into contact with a polishing target surface of the substrate and polish the polishing target surface of the substrate, and a spray unit including a spray member configured to spray a fluid toward the substrate carrier.

Abstract: A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first cleaning line and the second cleaning line, a first retransfer robot configured to transfer a substrate from the front-end module to the first stage, a second stage disposed between the first polishing line and the second polishing line, and a second retransfer robot configured to transfer the substrate between at least two locations of the first cleaning line, the second cleaning line, the first stage, and the second stage.

Abstract: A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first processing line and the second processing line, and a first retransfer robot configured to transfer a substrate from the front-end module to the first stage.

Abstract: An electronic apparatus is provided. The electronic device includes a plurality of multi-band antennas configured to transmit and receive data to and from an access point, and a processor configured to transmit and receive predetermined data to and from the access point through each of the plurality of multi-band antennas and calculate a data transmission rate of each of the plurality of multi-band antennas, and to select at least one multi-band antenna for transmitting and receiving data to and from the access point based on the calculated data transmission rates.

Abstract: A broadcast receiving device includes: a broadcast receiver configured to receive a digital broadcasting signal; a display configured to display images obtained by decoding the received digital broadcasting signal; and a processor configured to control the display to display a list of other channels associated with a program channel if a start of an advertisement image after a program image among the images is sensed, and display an image of a selected channel if a user selects one channel from the list of other channels.

Abstract: An apparatus and a method for performing an attenuation function on a signal using an attenuator in a cable broadcast receiver having a Low Noise Amplifier (LNA) that does not perform an attenuation function on a signal are provided. In the method, an input Radio Frequency (RF) signal is tuned, The RF signal is converted into an Intermediate Frequency (IF) signal. An intensity of the converted IF signal is compared to a threshold, and an RF Automatic Gain Control (AGC) value is generated based on a result of the comparison. When the generated RF AGC value is smaller than an RF AGC threshold, the attenuator is turned on to attenuate the input RF signal by a predefined amount. Therefore, a high SNR, such as in an analog-digital composite signal, may be obtained without using an LNA that performs an attenuation function on a signal.

Abstract: An apparatus and a method for performing an attenuation function on a signal using an attenuator in a cable broadcast receiver having a Low Noise Amplifier (LNA) that does not perform an attenuation function on a signal are provided. In the method, an input Radio Frequency (RF) signal is tuned, The RF signal is converted into an Intermediate Frequency (IF) signal. An intensity of the converted IF signal is compared to a threshold, and an RF Automatic Gain Control (AGC) value is generated based on a result of the comparison. When the generated RF AGC value is smaller than an RF AGC threshold, the attenuator is turned on to attenuate the input RF signal by a predefined amount. Therefore, a high SNR, such as in an analog-digital composite signal, may be obtained without using an LNA that performs an attenuation function on a signal.