Abstract: An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A mobile terminal includes an apparatus for reducing Time Division Multiple Access (TDMA) noise in the mobile communication terminal. The apparatus includes a first output path including a resistance element; a second output path not including a resistance element; a modem for, when detecting an event for outputting an audio signal, determining an output path of the audio signal and outputting a control signal indicating the determined output path; and a switch for switching according to the control signal and providing the audio signal to either the first output path or the second output path.

Abstract: An electric power control method and a mobile device adapted thereto are provided that stores power for subsequent provision to a Subscriber Identity Module (SIM). In exemplary operation, both an RF communication unit and a charging unit are operative. The charging unit is coupled to a SIM electric power supply and the SIM. Upon occurrence of a voltage drop in the electric power supplied to the SIM, there is a switch to the charging unit to supply the charged electric power to the SIM.

Abstract: A mobile terminal includes an apparatus for reducing Time Division Multiple Access (TDMA) noise in the mobile communication terminal. The apparatus includes a first output path including a resistance element; a second output path not including a resistance element; a modem for, when detecting an event for outputting an audio signal, determining an output path of the audio signal and outputting a control signal indicating the determined output path; and a switch for switching according to the control signal and providing the audio signal to either the first output path or the second output path.

Abstract: An electric power control method and a mobile device adapted thereto are provided that stores power for subsequent provision to a Subscriber Identity Module (SIM). In exemplary operation, both an RF communication unit and a charging unit are operative. The charging unit is coupled to a SIM electric power supply and the SIM. Upon occurrence of a voltage drop in the electric power supplied to the SIM, there is a switch to the charging unit to supply the charged electric power to the SIM.

Abstract: The present invention relates to stabilized isothiazolone compositions and methods of stabilization of isothiazolone, more particularly, to stabilized isothiazolone solutions comprising (a) an isothiazolone composition, (b) sulfuric acid, and (c) solvent.