Patents by Inventor Gi Woo Kim
Gi Woo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11989602Abstract: A display device is disclosed that includes a plurality of pixels and a plurality of code pixels. The pixels include light-emitting elements, which display an image. The code pixels are disposed in the same layer as the pixels and are adjacent to a reference point disposed between the pixels. The code pixels include infrared light-emitting elements, which emit infrared light. At least one of the code pixels, disposed in a particular direction from the reference point, emit the infrared light to provide a code pattern having position information.Type: GrantFiled: March 7, 2022Date of Patent: May 21, 2024Assignee: Samsung Display Co., Ltd.Inventors: Gi Na Yoo, Ju Yeon Kim, Won Sang Park, Chang Woo Shim, Seong Jun Lee
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Patent number: 11989381Abstract: A display device includes subpixels on a substrate, position code patterns having a predetermined position code shape, when viewed in a plan view, each position code pattern being disposed at a region between at least two adjacent subpixels, and a pixel-defining layer defining a region where each subpixel is disposed and covering the position code patterns. The plurality of position code patterns are formed in a planar code shape and are configured to reflect light incident through the pixel-defining layer.Type: GrantFiled: September 26, 2022Date of Patent: May 21, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Gi Na Yoo, Ju Yeon Kim, Won Sang Park, Chang Woo Shim, Seong Jun Lee, Dong Hee Choi
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Patent number: 11961775Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: November 8, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Patent number: 11959202Abstract: Provided are an apparatus for manufacturing a textile grid with increased adhesion and a method thereof capable of integrating the textile grid with a concrete structure by increasing the adhesion of the textile grid when the concrete structure is built, repaired, or reinforced, increasing structural safety and durability of the concrete structure, increasing a working speed by coating a surface of the textile grid with an abrasive material powder that is a surface coating material in an automatic series of processes immediately after the textile grid is manufactured, and increasing coating performance by automatically inspecting and adjusting the amount of the coating material applied to the surface of the textile grid using a camera.Type: GrantFiled: November 27, 2019Date of Patent: April 16, 2024Assignee: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGYInventors: Hyeong Yeol Kim, Kyung Taek Koh, Gum Sung Ryu, Gi Hong An, Dong Woo Seo, Seung Seop Jin
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Publication number: 20240120262Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.Type: ApplicationFiled: December 15, 2023Publication date: April 11, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
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Publication number: 20240102859Abstract: The disclosure relates to an ultrathin micro-spectrometer and a method of manufacturing the same, and more particularly, relates to an ultrathin micro-spectrometer including: a lens portion including: a convex lens; and a back-reflection grating layer which is formed on a rear surface of the convex lens and on the same surface of which a reflective diffraction grating and a first planar reflector are arranged; a substrate layer which is disposed to be spaced apart from the lens portion and on which a light incidence microslit is formed; a second planar reflector which is formed on the substrate layer; and a complementary metal-oxide-semiconductor (CMOS) sensor on which light reflected by the lens portion is focused, and a method of manufacturing the same.Type: ApplicationFiled: September 7, 2022Publication date: March 28, 2024Inventors: Ki Hun Jeong, Jung Woo Park, Jae Hun Jeon, Gi Beom Kim
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Publication number: 20240105934Abstract: A positive electrode active material for a lithium secondary battery has a mixture of microparticles having a predetermined average particle size (D50) and macroparticles having a larger average particle size (D50) than the microparticles. The microparticles have the average particle size (D50) of 1 to 10 ?m and are at least one selected from the group consisting of particles having a carbon material coating layer on all or part of a surface of primary macroparticles having an average particle size (D50) of 1 ?m or more, particles having a carbon material coating layer on all or part of a surface of secondary particles formed by agglomeration of the primary macroparticles, and a mixture thereof. The macroparticles are secondary particles having an average particle size (D50) of 5 to 20 ?m formed by agglomeration of primary microparticles having a smaller average particle size (D50) than the primary macroparticles.Type: ApplicationFiled: June 9, 2022Publication date: March 28, 2024Applicant: LG Energy Solution, Ltd.Inventors: Gi-Beom Han, Jong-Woo Kim, Eun-Sol Lho, Kang-Joon Park, Min Kwak, Seul-Ki Kim, Hyeong-Il Kim, Sang-Min Park, Sang-Wook Lee, Wang-Mo Jung
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Publication number: 20240088059Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
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Patent number: 10288275Abstract: An LED lighting fixture includes: an LED unit which emits light; a control board in which a plurality of LED units are arranged and which supplies power to the LED unit; a heat dissipation unit which is coupled to the control board so as to transmit heat generated from the control board; a cooling unit coupled to the heat dissipation unit for cooling the heat dissipation unit by non-powered circulation of an embedded actuating fluid; and a hollow illumination body unit which embeds the heat dissipation unit and the cooling unit therein and supports the heat dissipation unit so as to have the LED unit exposed.Type: GrantFiled: August 17, 2016Date of Patent: May 14, 2019Assignee: SAEBIT TECH INC.Inventors: Gi Woo Kim, Sang Min Park
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Publication number: 20180231230Abstract: An LED lighting fixture includes: an LED unit which emits light; a control board in which a plurality of LED units are arranged and which supplies power to the LED unit; a heat dissipation unit which is coupled to the control board so as to transmit heat generated from the control board; a cooling unit coupled to the heat dissipation unit for cooling the heat dissipation unit by non-powered circulation of an embedded actuating fluid; and a hollow illumination body unit which embeds the heat dissipation unit and the cooling unit therein and supports the heat dissipation unit so as to have the LED unit exposed.Type: ApplicationFiled: August 17, 2016Publication date: August 16, 2018Applicant: SAEBIT TECH INC.Inventors: Gi Woo KIM, Sang Min PARK
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Patent number: 9810301Abstract: Disclosed is a torque converter in a vehicle, in which a torsional damper reduces a natural frequency and absorbs vibration energy in an anti-resonance state for enhancing a vibration isolation function. The torque converter in a vehicle includes a torsional damper including a retaining plate coupled to the piston, a plurality of springs arranged at the retaining plate for imparting elastic force in a circumferential direction, a driven plate coupled to a spline hub which acts as a reaction force on the springs and forwards driving power to a transmission, and an inertial lever arranged between the piston and the driven plate, the inertial lever including a fixed pivot coupling portion coupled to the piston with a fixed pivot and a movable pivot coupling portion coupled to the driven plate with a movable pivot.Type: GrantFiled: April 9, 2013Date of Patent: November 7, 2017Assignee: Korea Powertrain Co., Ltd.Inventors: Ki-Hyun Kwon, Gi-Woo Kim, Soon-Seok Hong
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Patent number: 9341525Abstract: Provided are a torque transducer, a method for manufacturing the torque transducer, and a transmission for a vehicle using the torque transducer. The torque transducer includes a mechano-luminescent (ML) part disposed on a torque measuring object and an illumination sensor disposed to be spaced apart from the ML part.Type: GrantFiled: July 22, 2014Date of Patent: May 17, 2016Assignee: Kyungpook National University Industry-Academic Cooperation FoundationInventors: Gi Woo Kim, Ji Sik Kim
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Publication number: 20150260270Abstract: Disclosed is a torque converter in a vehicle, in which a torsional damper reduces a natural frequency and absorbs vibration energy in an anti-resonance state for enhancing a vibration isolation function. The torque converter in a vehicle includes a torsional damper including a retaining plate coupled to the piston, a plurality of springs arranged at the retaining plate for imparting elastic force in a circumferential direction, a driven plate coupled to a spline hub which acts as a reaction force on the springs and forwards driving power to a transmission, and an inertial lever arranged between the piston and the driven plate, the inertial lever including a fixed pivot coupling portion coupled to the piston with a fixed pivot and a movable pivot coupling portion coupled to the driven plate with a movable pivot.Type: ApplicationFiled: April 9, 2013Publication date: September 17, 2015Inventors: Ki-Hyun Kwon, Gi-Woo Kim, Soon-Seok Hong
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Publication number: 20150020611Abstract: Provided are a torque transducer, a method for manufacturing the torque transducer, and a transmission for a vehicle using the torque transducer. The torque transducer includes a mechano-luminescent (ML) part disposed on a torque measuring object and an illumination sensor disposed to be spaced apart from the ML part.Type: ApplicationFiled: July 22, 2014Publication date: January 22, 2015Inventors: Gi Woo Kim, Ji Sik Kim