Patents by Inventor Gi-young Jeun
Gi-young Jeun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11387162Abstract: A packaged power transistor device includes a Direct-Bonded Copper (“DBC”) substrate. Contact pads of a first lead are attached with solderless welds to a metal layer of the DBC substrate. In a first example, the solderless welds are ultrasonic welds. In a second example, the solderless welds are laser welds. A single power transistor realized on a single semiconductor die is attached to the DBC substrate. In one example, a first bond pad of the die is wire bonded to a second lead, and a second bond pad of the die is wire bonded to a third lead. The die, the wire bonds, and the metal layer of the DBC substrate are covered with an amount of plastic encapsulant. Lead trimming is performed to separate the first, second and third leads from the remainder of a leadframe, the result being the packaged power transistor device.Type: GrantFiled: June 9, 2020Date of Patent: July 12, 2022Assignee: Littelfuse, Inc.Inventors: Gi-Young Jeun, Kang Rim Choi
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Publication number: 20200303281Abstract: A packaged power transistor device includes a Direct-Bonded Copper (“DBC”) substrate. Contact pads of a first lead are attached with solderless welds to a metal layer of the DBC substrate. In a first example, the solderless welds are ultrasonic welds. In a second example, the solderless welds are laser welds. A single power transistor realized on a single semiconductor die is attached to the DBC substrate. In one example, a first bond pad of the die is wire bonded to a second lead, and a second bond pad of the die is wire bonded to a third lead. The die, the wire bonds, and the metal layer of the DBC substrate are covered with an amount of plastic encapsulant. Lead trimming is performed to separate the first, second and third leads from the remainder of a leadframe, the result being the packaged power transistor device.Type: ApplicationFiled: June 9, 2020Publication date: September 24, 2020Applicant: IXYS, LLCInventors: Gi-Young Jeun, Kang Rim Choi
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Patent number: 10720376Abstract: A packaged power transistor device includes a Direct-Bonded Copper (“DBC”) substrate. Contact pads of a first lead are attached with solderless welds to a metal layer of the DBC substrate. In a first example, the solderless welds are ultrasonic welds. In a second example, the solderless welds are laser welds. A single power transistor realized on a single semiconductor die is attached to the DBC substrate. In one example, a first bond pad of the die is wire bonded to a second lead, and a second bond pad of the die is wire bonded to a third lead. The die, the wire bonds, and the metal layer of the DBC substrate are covered with an amount of plastic encapsulant. Lead trimming is performed to separate the first, second and third leads from the remainder of a leadframe, the result being the packaged power transistor device.Type: GrantFiled: November 2, 2018Date of Patent: July 21, 2020Assignee: Littelfuse, Inc.Inventors: Gi-Young Jeun, Kang Rim Choi
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Publication number: 20190088571Abstract: A packaged power transistor device includes a Direct-Bonded Copper (“DBC”) substrate. Contact pads of a first lead are attached with solderless welds to a metal layer of the DBC substrate. In a first example, the solderless welds are ultrasonic welds. In a second example, the solderless welds are laser welds. A single power transistor realized on a single semiconductor die is attached to the DBC substrate. In one example, a first bond pad of the die is wire bonded to a second lead, and a second bond pad of the die is wire bonded to a third lead. The die, the wire bonds, and the metal layer of the DBC substrate are covered with an amount of plastic encapsulant. Lead trimming is performed to separate the first, second and third leads from the remainder of a leadframe, the result being the packaged power transistor device.Type: ApplicationFiled: November 2, 2018Publication date: March 21, 2019Applicant: IXYS, LLCInventors: Gi-Young Jeun, Kang Rim Choi
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Publication number: 20170178998Abstract: A packaged power transistor device includes a Direct-Bonded Copper (“DBC”) substrate. Contact pads of a first lead are attached with solderless welds to a metal layer of the DBC substrate. In a first example, the solderless welds are ultrasonic welds. In a second example, the solderless welds are laser welds. A single power transistor realized on a single semiconductor die is attached to the DBC substrate. In one example, a first bond pad of the die is wire bonded to a second lead, and a second bond pad of the die is wire bonded to a third lead. The die, the wire bonds, and the metal layer of the DBC substrate are covered with an amount of plastic encapsulant. Lead trimming is performed to separate the first, second and third leads from the remainder of a leadframe, the result being the packaged power transistor device.Type: ApplicationFiled: March 7, 2017Publication date: June 22, 2017Inventors: Gi-Young Jeun, Kang Rim Choi
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Publication number: 20130175704Abstract: A packaged power transistor device includes a Direct-Bonded Copper (“DBC”) substrate. Contact pads of a first lead are attached with solderless welds to a metal layer of the DBC substrate. In a first example, the solderless welds are ultrasonic welds. In a second example, the solderless welds are laser welds. A single power transistor realized on a single semiconductor die is attached to the DBC substrate. In one example, a first bond pad of the die is wire bonded to a second lead, and a second bond pad of the die is wire bonded to a third lead. The die, the wire bonds, and the metal layer of the DBC substrate are covered with an amount of plastic encapsulant. Lead trimming is performed to separate the first, second and third leads from the remainder of a leadframe, the result being the packaged power transistor device.Type: ApplicationFiled: January 5, 2012Publication date: July 11, 2013Applicant: IXYS CorporationInventors: Gi-Young Jeun, Kang Rim Choi
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Patent number: 7501700Abstract: A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator has a first surface adjacent to a second surface of the first portion, and a second surface opposite to the first surface of the insulator and exposed to the outside. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit.Type: GrantFiled: January 6, 2006Date of Patent: March 10, 2009Assignee: Fairchild Korea Semiconductor Ltd.Inventors: Gi-Young Jeun, O-Seob Jeun, Eun-Ho Lee, Seung-Won Lim
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Patent number: 7449774Abstract: A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator is adjacent to a second surface of the first portion of the lead frame. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit and the control circuit.Type: GrantFiled: September 29, 2000Date of Patent: November 11, 2008Assignee: Fairchild Korea Semiconductor Ltd.Inventors: Gi-Young Jeun, O-Seob Jeun, Eun-Ho Lee, Seung-Won Lim
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Patent number: 7208819Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.Type: GrantFiled: October 26, 2004Date of Patent: April 24, 2007Assignee: Fairchild Korea Semiconductor Ltd.Inventors: Gi-young Jeun, Sung-min Park, Joo-sang Lee, Sung-won Lim, O-seob Jeon, Byoung-ok Lee, Young-gil Kim, Gwi-gyeon Yang
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Patent number: 7061080Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.Type: GrantFiled: June 10, 2002Date of Patent: June 13, 2006Assignee: Fairchild Korea Semiconductor Ltd.Inventors: Gi-young Jeun, Sung-min Park, Joo-sang Lee, Sung-won Lim, O-seob Jeon, Byoung-ok Lee, Young-gil Kim, Gwi-gyeon Yang
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Publication number: 20060113562Abstract: A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator has a first surface adjacent to a second surface of the first portion, and a second surface opposite to the first surface of the insulator and exposed to the outside. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit.Type: ApplicationFiled: January 6, 2006Publication date: June 1, 2006Inventors: Gi-Young Jeun, O-Seob Jeun, Eun-Ho Lee, Seung-Won Lim
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Publication number: 20050056918Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.Type: ApplicationFiled: October 26, 2004Publication date: March 17, 2005Applicant: Fairchild Korea Semiconductor Ltd.Inventors: Gi-young Jeun, Sung-min Park, Joo-sang Lee, Sung-won Lim, O-seob Jeon, Byoung-ok Lee, Young-gil Kim, Gwi-gyeon Yang
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Patent number: 6710439Abstract: A power semiconductor module in which a main circuit terminal lead frame part and a control circuit lead frame part are bent toward a main circuit lead frame part, is provided. The power semiconductor module includes a main circuit part; a control circuit part and a control circuit terminal which are placed along a plane perpendicular to the main circuit part; a main circuit terminal placed along another plane perpendicular to the main circuit part, facing the control circuit part the control circuit terminal; a bonding wire; and a mold compound. Accordingly, it is possible to realize a light and compact intelligent power module that is simple to manufactured at a low cost.Type: GrantFiled: September 12, 2002Date of Patent: March 23, 2004Assignee: Fairchild Korea Semiconductor Ltd.Inventors: Keun-hyuk Lee, Gi-Young Jeun, O-seob Jeon
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Publication number: 20030067065Abstract: A power semiconductor module in which a main circuit terminal lead frame part and a control circuit lead frame part are bent toward a main circuit lead frame part, is provided. The power semiconductor module includes a main circuit part; a control circuit part and a control circuit terminal which are placed along a plane perpendicular to the main circuit part; a main circuit terminal placed along another plane perpendicular to the main circuit part, facing the control circuit part the control circuit terminal; a bonding wire; and a mold compound. Accordingly, it is possible to realize a light and compact intelligent power module that is simple to manufactured at a low cost.Type: ApplicationFiled: September 12, 2002Publication date: April 10, 2003Applicant: Fairchild Korea Semiconductor Ltd.Inventors: Keun-hyuk Lee, Gi-Young Jeun, O-seob Jeon
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Publication number: 20030011054Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.Type: ApplicationFiled: June 9, 2002Publication date: January 16, 2003Applicant: Fairchild Semiconductor CorporationInventors: Gi-young Jeun, Sung-min Park, Joo-sang Lee, Sung-won Lim, O-seob Jeon, Byoung-ok Lee, Young-gil Kim, Gwi-gyeon Yang
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Patent number: 6365965Abstract: A power semiconductor module, a metal terminal for the power semiconductor module, and methods of fabricating a power semiconductor module and the metal terminal are disclosed. In the power semiconductor module, the metal terminal improves the adhesive strength between the metal terminal and a substrate of the module by increasing the surface area of the metal terminal that contacts an adhesive. A hole and a protrusion formed in an attachment plate of the terminal provide more surface area contacting the adhesive, thereby increasing the adhesive strength between the metal terminal and a metal substrate.Type: GrantFiled: September 24, 1999Date of Patent: April 2, 2002Assignee: Samsung Electronics Co., Ltd.Inventor: Gi-young Jeun