Patents by Inventor Gianni R. BARDELLA

Gianni R. BARDELLA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layered, shielded and grounded cables and related methods
    Patent number: 11735338
    Abstract: Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: August 22, 2023
    Assignee: Molex, LLC
    Inventors: Jared D. Sullivan, Michael McGee, Eran J. Jones, David Gader, Andrew J. Wehrli, Todd D. Ward, Gianni R. Bardella, Ayman Isaac, Darian Schulz
  • METHODS AND STRUCTURES FOR TERMINATING CABLE GROUND WIRES
    Publication number: 20230048710
    Abstract: A method for connecting a ground wire of cable comprises the steps of: receiving a ground wire of the cable, over one or more core signal conductors of the cable, in an open, connection slot or notch of a respective grounding section of a grounding structure; and restraining the ground wire so that the ground wire physically contacts a body of the respective grounding section and forms an electrical ground path with the body of the section.
    Type: Application
    Filed: January 14, 2021
    Publication date: February 16, 2023
    Applicant: Molex, LLC
    Inventors: Gianni R. BARDELLA, Ayman ISAAC, Darian SCHULZ, Thomas G. PREMO, Augusto PANELLA
  • MULTI-LAYERED, SHIELDED AND GROUNDED CABLES AND RELATED METHODS
    Publication number: 20220384069
    Abstract: Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Applicant: Molex, LLC
    Inventors: Jared D. SULLIVAN, Michael MCGEE, Eran J. JONES, David GADER, Andrew J. WEHRLI, Todd D. Ward, Gianni R. BARDELLA, Ayman ISAAC, Darian SCHULZ
  • MULTI-LAYERED, SHIELDED AND GROUNDED CABLES AND RELATED METHODS
    Publication number: 20210217541
    Abstract: Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
    Type: Application
    Filed: January 14, 2021
    Publication date: July 15, 2021
    Applicant: Molex, LLC
    Inventors: Jared D. SULLIVAN, Michael MCGEE, Eran J. JONES, David GADER, Andrew J. WEHRLI, Todd D. Ward, Gianni R. BARDELLA, Ayman ISAAC, Darian SCHULZ