Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.

Abstract: The present disclosure relates to an organic compound including at least one carbazolyl moiety fused with an alicyclic or hetero alicyclic ring and linked to directly or via a linker to a triazine moiety and at least one blocking moiety linked the triazine moiety, an organic light emitting diode and an organic light emitting device including the organic compound. The organic compound can implement high luminous efficiency as enhancing delayed fluorescent property, minimize reduction of the luminous lifespan caused by substituent degradation, and can secure high triplet energy level owing to no conjugation extensions. The organic light emitting diode and the organic light emitting device using the organic compound can have beneficial luminous efficiency and the luminous lifespan.

Abstract: Disclosed herein is an over-slam bumper for a vehicle. The over-slam bumper includes: a bumper unit (100) of which an end portion protrudes toward a door to absorb shock generated between a vehicle body and the door; and a mounting unit (200) coupled with the bumper unit (100) to fix the bumper unit to the vehicle body, wherein the bumper unit (100) includes: an elastic part for absorbing shock generated when getting in contact with the door; and a coupling part (116) connected to the elastic part and coupled with the mounting unit (200). The elastic part includes a buckling part (111) for absorbing shock by buckling; a compression part (130) for absorbing shock by compression; and an elastic air compression part for absorbing shock by sealing the inside air to compress inside air.

Abstract: An organic light emitting device including: a substrate defining a first pixel region and a second pixel region; and an organic light emitting diode over the substrate. The organic light emitting diode includes a transmissive electrode, a reflective electrode facing the transmissive electrode and an emissive layer disposed between the transmissive electrode and the reflective electrode. The emissive layer includes a first emissive layer and a second emissive layer. The first emissive layer is in the first pixel region and includes: a first blue emitting material layer including a first blue fluorescent compound, and a second blue emitting material layer including a second blue fluorescent compound and a blue phosphorescent compound. The second emissive layer is in the second pixel region and includes: a first green emitting material layer including a first green delayed fluorescent compound, and a second green emitting material layer including a second green delayed fluorescent compound.

Abstract: Controlling an area fraction of a region of a capacitance formation portion of a multilayer electronic component may suppress occurrence of a short circuit between internal electrodes disposed inside a body of the multilayer electronic component, lower capacitance or reduced breakdown voltage. A range of brightness intensity of the region of the capacitance formation portion of the multilayer electronic component is 110% or more and 126% or less compared to an average value of brightness intensity of a cover portion disposed on the capacitance formation portion.

Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with the dielectric layers in a first direction, wherein when a space where the plurality of internal electrodes overlap each other in the first direction is defined as a capacitance forming portion, the plurality of internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross section of the body in the first and second directions.

Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage.

Abstract: A multilayer electronic component includes: a body including internal electrodes alternately disposed with dielectric layers in a first direction, wherein when a region in which the internal electrodes overlap each other in the first direction is a capacitance forming portion, the internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross-section of the body in the first and second directions, (F1+F2)/D1×100 is 35 or less, where F1 is a maximum distance from an uppermost internal electrode to an uppermost flat internal electrode in the first direction, F2 is a maximum distance from a lowermost internal electrode to a lowermost flat internal electrode in the first direction, and D1 is a size of the capacitance forming portion in the first direction at the center thereof in the second direction.

Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage. The internal electrode may include a plurality of conductor portions and a plurality of cut-off portions.

Abstract: Provided is an optical system which may acquire a hyperspectral image by acquiring a spectral image of an object to be measured, which includes, to collect spectral data and train the neural network, an image forming part forming an image from an object to be measured and transmitting collimated light, a slit moving to scan the incident image and passing and outputting a part of the formed image, and a first optical part obtaining spectral data by splitting light of the image received through the slit by wavelength. Also, the system includes, to decompose overlapped spectral data and to infer hyperspectral image data through the trained neural network, an image forming part forming an image from an object to be measured and transmitting collimated light, and a first optical part obtaining spectral data by splitting light of the received image by wavelength.

Abstract: The present invention provides a heterocyclic compound represented by Formula 1 and an organic light-emitting device comprising the same.

Abstract: An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.

Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.

Abstract: The present disclosure relates to a system and method for predicting and detecting the outbreak of a fire.

Abstract: An embodiment of the present disclosure provides an arc risk management method comprising: pre-processing measurement values of currents flowing into an electric apparatus; estimating a level of arc energy in the electric apparatus by inputting the measurement values into one artificial intelligence network comprising a first layer including a dilated convolutional neural network and a second layer including a recurrent neural network; and indicating an arc risk to the electric apparatus in a quantitative way according to the level of arc energy.

Abstract: In one example, a semiconductor device includes a substrate. The substrate includes a base including a top side and a cavity side opposite to the top side, leads extending from the cavity side, and an encapsulant interposed between the leads. An electronic component is located on the cavity side and spaced apart from the encapsulant. Other examples and related methods are also disclosed herein.

Abstract: In one example, an electronic device includes an embedded module, which includes a module substrate and module components coupled to the module substrate. A device substrate is coupled to the first module substrate. Device terminals are coupled to the module components and a device encapsulant structure encapsulates the embedded module, the device substrate, and the device terminals. A portion of the device substrate is exposed from the device encapsulant structure and portions of the device terminals are exposed from the device encapsulant structure. Other examples and related methods are also disclosed herein.

Abstract: Disclosed is an amplification circuit, which includes a first amplifier that receives an external signal and performs first band pass filtering on the external signal to output a first filter signal, and a second amplifier that receives the first filter signal and performs second band pass filtering on the first filter signal to output a second filter signal, and a frequency pass bandwidth of the second band pass filtering is narrower than a frequency pass bandwidth of the first band pass filtering.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.

Abstract: A hybrid communication device, an operation method thereof, and a communication system including the same are provided. The hybrid communication device includes a contact unit that includes an antenna for receiving a first communication signal and an electrode for receiving a second signal, a switch controller that includes a first switch and a second switch and controls the first switch and the second switch based on a change in capacitance of the electrode, and a signal processing unit that receives at least one of the first communication signal and the second communication signal from the contact unit via the first switch and processes the received signal. The first switch is connected to the contact unit, and the signal processing unit is connected to the first switch.