Patents by Inventor Gil-Hun Song
Gil-Hun Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11594421Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.Type: GrantFiled: September 24, 2020Date of Patent: February 28, 2023Assignee: SEMES CO., LTD.Inventors: Youngil Lee, Jungbong Choi, Seungho Lee, Gui Su Park, Gil Hun Song, Seung Hoon Oh, Jonghan Kim
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Publication number: 20210013047Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.Type: ApplicationFiled: September 24, 2020Publication date: January 14, 2021Inventors: Youngil LEE, Jungbong CHOI, Seungho LEE, Gui Su PARK, Gil Hun SONG, Seung Hoon OH, Jonghan KIM
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Patent number: 10699918Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a housing having a treating space therein; a spin head for supporting and rotating a substrate in the treating space; and a chemical supply unit having an injection nozzle for supplying a chemical to the substrate which is supported by the spin head, wherein the injection nozzle comprises a nozzle body, and wherein the nozzle body comprises an inner space for receiving a chemical and minute holes which are connected with the inner space for discharging the chemicals to downward.Type: GrantFiled: April 11, 2017Date of Patent: June 30, 2020Assignee: SEMES CO., LTD.Inventors: Buyoung Jung, Jin Tack Yu, Gil Hun Song, Sun Yong Park
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Publication number: 20190115224Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.Type: ApplicationFiled: October 12, 2018Publication date: April 18, 2019Inventors: Youngil LEE, Jungbong CHOI, Seungho LEE, Gui Su PARK, Gil Hun SONG, Seung Hoon OH, Jonghan KIM
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Patent number: 10232415Abstract: A substrate-treating apparatus is disclosed. The substrate-treating apparatus may include a vessel configured to provide a treatment space therein, a substrate-supporting unit provided in the vessel to support a substrate, and a spraying member configured to spray treatment solution on the substrate loaded on the substrate-supporting unit. The vessel may have an inner side surface, on which at least one texture pattern is formed.Type: GrantFiled: May 29, 2015Date of Patent: March 19, 2019Assignees: Semes Co., Ltd., Samsung Electronics Co., Ltd.Inventors: Gil Hun Song, Ki Ryong Choi, Young Chol Choi, Giu Su Park, Sun Yong Park
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Publication number: 20180337070Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating method includes removing a portion of the thin film by irradiating a laser to the substrate, and after the removing of the portion of the thin film, removing the remaining portion of the thin film by supplying a chemical to the substrate.Type: ApplicationFiled: May 15, 2018Publication date: November 22, 2018Inventors: Byungsun Bang, Buyoung Jung, Jungbong Choi, Bong Joo Kim, Youngil Lee, Gil Hun Song, Gui Su Park, Kwang Ryul Kim, Kwang-Seop Lee, Jin Tack Yu
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Publication number: 20170316958Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a housing having a treating space therein; a spin head for supporting and rotating a substrate in the treating space; and a chemical supply unit having an injection nozzle for supplying a chemical to the substrate which is supported by the spin head, wherein the injection nozzle comprises a nozzle body, and wherein the nozzle body comprises an inner space for receiving a chemical and minute holes which are connected with the inner space for discharging the chemicals to downward.Type: ApplicationFiled: April 11, 2017Publication date: November 2, 2017Inventors: Buyoung JUNG, Jin Tack YU, Gil Hun SONG, Sun Yong PARK
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Patent number: 9587880Abstract: Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.Type: GrantFiled: May 30, 2013Date of Patent: March 7, 2017Assignee: SEMES CO., LTD.Inventors: Boong Kim, Ki Bong Kim, Gil Hun Song, Oh Jin Kwon
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Patent number: 9275852Abstract: Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.Type: GrantFiled: May 30, 2013Date of Patent: March 1, 2016Assignee: Semes Co., Ltd.Inventors: KiBong Kim, Boong Kim, Gil Hun Song, Oh Jin Kwon
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Publication number: 20150343496Abstract: A substrate-treating apparatus is disclosed. The substrate-treating apparatus may include a vessel configured to provide a treatment space therein, a substrate-supporting unit provided in the vessel to support a substrate, and a spraying member configured to spray treatment solution on the substrate loaded on the substrate-supporting unit. The vessel may have an inner side surface, on which at least one texture pattern is formed.Type: ApplicationFiled: May 29, 2015Publication date: December 3, 2015Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Gil Hun SONG, Ki Ryong CHOI, Young Chol CHOI, Giu Su PARK, Sun Yong PARK
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Publication number: 20150303036Abstract: A substrate treatment apparatus includes a seal on at least one of upper or lower chambers of a process chamber. The seal hermetically closes the substrate treatment region, and may be at a location to prevent a gap from forming between the upper and lower chambers. The lower chamber includes an inner wall and an outer wall defining a groove including the seal. The inner wall has a top surface lower than that of the outer wall. The seal has an atypical cross-sectional shape with a recess facing the substrate treatment region.Type: ApplicationFiled: February 2, 2015Publication date: October 22, 2015Applicant: Semes Co., Ltd.Inventors: Jihoon JEONG, Gil Hun SONG, Ki Sang EUM, Yongsun KO, Kuntack LEE, Yongmyung JUN, Yong-Jhin CHO
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Publication number: 20130318815Abstract: Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.Type: ApplicationFiled: May 30, 2013Publication date: December 5, 2013Inventors: KiBong KIM, Boong KIM, Gil Hun SONG, Oh Jin KWON
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Publication number: 20130318812Abstract: Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.Type: ApplicationFiled: May 30, 2013Publication date: December 5, 2013Inventors: Boong Kim, Ki Bong Kim, Gil Hun Song, Oh Jin Kwon
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Publication number: 20130081658Abstract: Provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes a housing providing a space for performing a process, and a plurality of support members vertically arranged in the housing at predetermined intervals to support edges of substrates, respectively.Type: ApplicationFiled: September 11, 2012Publication date: April 4, 2013Applicant: SEMES CO., LTD.Inventors: Gil Hun SONG, Jeong Yong BAE, Kyo Woog KOO
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Patent number: 8282771Abstract: In a spin unit for rotating a substrate and a method of processing the substrate, the substrate is secured on a support and is rotated on the support. Processing materials including drying gases, etching solutions and cleaning solutions are selectively supplied onto a bottom surface of the rotating substrate. The same processing materials are also selectively supplied onto a top surface of the substrate. The top and bottom surfaces of the substrate are simultaneously processed by simultaneous supply of the processing materials through the first and second sub-injectors.Type: GrantFiled: September 16, 2008Date of Patent: October 9, 2012Assignee: Semes Co., Ltd.Inventors: Gil-Hun Song, Pyeng-Jae Park
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Publication number: 20090075484Abstract: In a spin unit for rotating a substrate and a method of processing the substrate, the substrate is secured on a support and is rotated on the support. Processing materials including drying gases, etching solutions and cleaning solutions are selectively supplied onto a bottom surface of the rotating substrate. The same processing materials are also selectively supplied onto a top surface of the substrate. The top and bottom surfaces of the substrate are simultaneously processed by simultaneous supply of the processing materials through the first and second sub-injectors.Type: ApplicationFiled: September 16, 2008Publication date: March 19, 2009Inventors: Gil-Hun Song, Pyeng-Jae Park