Abstract: A method identifies at least one malfunctioning nozzle in a digital printing press, the digital printing press including a plurality of nozzles. The method includes printing a design on a substrate, acquiring at least one image of the printed design and identifying at least one artifact in the acquired image. The method further includes identifying the malfunctioning nozzle and classifying the at least one malfunctioning nozzle according to the at least one of the acquired image of the printed design, at least a portion of a nozzle pattern and at least a portion of a uniformity pattern.

Abstract: A method identifies at least one malfunctioning nozzle in a digital printing press, the digital printing press including a plurality of nozzles. The method includes printing a design on a substrate, acquiring at least one image of the printed design and identifying at least one artifact in the acquired image. The method further includes identifying the malfunctioning nozzle and classifying the at least one malfunctioning nozzle according to the at least one of the acquired image of the printed design, at least a portion of a nozzle pattern and at least a portion of a uniformity pattern.

Abstract: A method identifies at least one malfunctioning nozzle in a digital printing press, the digital printing press including a plurality of nozzles. The method includes printing a design on a substrate, acquiring at least one image of the printed design and identifying at least one artifact in the acquired image. The method further includes identifying the malfunctioning nozzle and classifying the at least one malfunctioning nozzle according to the at least one of the acquired image of the printed design, at least a portion of a nozzle pattern and at least a portion of a uniformity pattern.

Abstract: A method identifies at least one malfunctioning nozzle in a digital printing press, the digital printing press including a plurality of nozzles. The method includes printing a design on a substrate, acquiring at least one image of the printed design and identifying at least one artifact in the acquired image. The method further includes identifying the malfunctioning nozzle and classifying the at least one malfunctioning nozzle according to the at least one of the acquired image of the printed design, at least a portion of a nozzle pattern and at least a portion of a uniformity pattern.

Abstract: A method and device for measuring a height of a microscopic structure such as solder bumps. For simplicity of explanation, the invention is described with respect to phase information and amplitude information wherein phase detection and calculation algorithms are being used.

Abstract: A facility for applying a software patch is described. Using an automatic patching agent, the facility receives the software patch. In response to receiving the software patch, without user intervention, the facility performs the following acts: First, the facility identifies an instance of an executable module that is currently loaded, and to which the received software patch pertains. Second, the facility applies the received software patch to the identified loaded executable module instance to modify the behavior of the identified executable module instance.

Abstract: A facility for receiving an embedded policy is provided. The facility checks an application program image for the presence of an embedded policy. If an embedded policy is detected, the facility extracts the policy from within the application program image. The facility may then apply the extracted policy to the application program image before the application program image is loaded and/or executed. Moreover, the facility may check the application program image's integrity prior to extracting the embedded policy.

Abstract: A system, that includes a hybrid sensor that comprises: a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands.

Abstract: A facility for receiving an embedded policy is provided. The facility checks an application program image for the presence of an embedded policy. If an embedded policy is detected, the facility extracts the policy from within the application program image. The facility may then apply the extracted policy to the application program image before the application program image is loaded and/or executed. Moreover, the facility may check the application program image's integrity prior to extracting the embedded policy.

Abstract: A system, that includes a hybrid sensor that comprises: a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands.

Abstract: A facility for applying a software patch is described. Using an automatic patching agent, the facility receives the software patch. In response to receiving the software patch, without user intervention, the facility performs the following acts: First, the facility identifies an instance of an executable module that is currently loaded, and to which the received software patch pertains. Second, the facility applies the received software patch to the identified loaded executable module instance to modify the behavior of the identified executable module instance.

Abstract: A system and a method may be provided. The system may include an illumination module arranged to illuminate an object by short pulses of light that form at least one spot on the object; a collection module that comprises a sensor that is arranged to generate detection signals representative of three dimensional information about the object: and a mechanical stage that is arranged to introduce a movement between the object and at least one of the collection module and the illumination module.

Abstract: A method and an inspection system may be provided. The inspection system may include (a) a hybrid sensor that may include a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands; (b) a storage element arranged to store the monochromatic image and the multiple-color image; and (c) a defect detection module arranged to detect defects by processing at least one of the monochromatic image and the multiple-color image.

Abstract: A facility for receiving an embedded policy is provided. The facility checks an application program image for the presence of an embedded policy. If an embedded policy is detected, the facility extracts the policy from within the application program image. The facility may then apply the extracted policy to the application program image before the application program image is loaded and/or executed. Moreover, the facility may check the application program image's integrity prior to extracting the embedded policy.

Abstract: A facility for applying a software patch is described. Using an automatic patching agent, the facility receives the software patch. In response to receiving the software patch, without user intervention, the facility performs the following acts: First, the facility identifies an instance of an executable module that is currently loaded, and to which the received software patch pertains. Second, the facility applies the received software patch to the identified loaded executable module instance to modify the behavior of the identified executable module instance.

Abstract: A device for measuring a height of a microscopic structure, the device may include: a storage circuit arranged to store information that comprises amplitude information and phase information, wherein the information is indicative of a shape and a size of the microscopic structure; a mask generation circuit arranged to threshold pixels of the amplitude information to provide a mask that comprises masked amplitude pixels; a phase information circuit arranged to apply the mask on the phase information to provide masked phase pixels; select, out of the masked phase pixels, selected phase pixels that correspond to a phase criterion, the selected phase pixels have selected phase pixels attribute values; find, out of the phase information, elected phase pixels that have the selected phase pixel attribute values; and a height calculation circuit arranged to generate a height measurement result based the elected phase pixels.

Abstract: A facility for receiving an embedded policy is provided. The facility checks an application program image for the presence of an embedded policy. If an embedded policy is detected, the facility extracts the policy from within the application program image. The facility may then apply the extracted policy to the application program image before the application program image is loaded and/or executed. Moreover, the facility may check the application program image's integrity prior to extracting the embedded policy.

Abstract: A method and an inspection system that includes: a multi wafer support device arranged to concurrently support multiple wafers; optics arranged to acquire images of the multiple wafers supported by the multi wafer support element; a mechanical stage arranged to introduce movement between the multi wafer support element and the optics; and a processor arranged to process the images acquired by the optics.

Abstract: A method and an inspection system may be provided. The inspection system may include (a) a hybrid sensor that may include a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands; (b) a storage element arranged to store the monochromatic image and the multiple-color image; and (c) a defect detection module arranged to detect defects by processing at least one of the monochromatic image and the multiple-color image.

Abstract: A method and system for interference based detection of height (H) of a microscopic structure. Wherein N*(Ws/2)>H>(N?1)*(Ws/2); wherein N is a positive integer, w1 is a first wavelength of first light beams used to generate first interference patterns, w2 is a second wavelength of second light beams used to generate second interference patterns, and Ws is a synthetic wavelength and equals a ratio between (i) a product of a multiplication of w1 by w2 and (ii) a difference between w1 and w2.