Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.

Abstract: An optical encoder includes an optical encoder pattern of alternating light elements and dark elements, and an optical unit, including an optical emitter providing light to the encoder pattern, and an optical sensor including a photo-detector receiving the light from the optical encoder pattern and in response thereto outputting a sinusoidal signal indicating relative movement between the optical sensor and the encoder pattern. In one embodiment, the photo-detector has a diamond shape, a modified-diamond shape, or an hourglass shape. In another embodiment, at least one of the light elements and the dark elements of the optical encoder pattern has a diamond shape, a modified-diamond shape, or an hourglass shape.