Patents by Inventor Gina Hoang
Gina Hoang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9865551Abstract: Provided herein are multilayer structures having a reduced propensity to warp upon curing of certain components thereof. In one aspect, there are provided multilayer assemblies comprising a plurality of the above-described multilayer structures. In another aspect, there are provided methods for reducing wafer warpage upon cure of molding compositions applied thereto. In yet another aspect, there are provided methods for preparing wafers having substantially no warpage upon cure thereof.Type: GrantFiled: November 30, 2015Date of Patent: January 9, 2018Assignee: Henkel IP & Holding GmbHInventors: Tadashi Takano, Gina Hoang
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Patent number: 9780068Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.Type: GrantFiled: March 10, 2016Date of Patent: October 3, 2017Assignees: HENKEL AG & CO. KGAA, HENKEL IP & HOLDING GMBHInventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
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Publication number: 20160190094Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.Type: ApplicationFiled: March 10, 2016Publication date: June 30, 2016Applicant: HENKEL AG & Co. KGaAInventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
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Patent number: 9362105Abstract: A method for preparing a semiconductor with preapplied underfill comprises (a) providing a thinned silicon semiconductor wafer having a plurality of metallic bumps on its active face and, optionally, through-silica-vias vertically through the silicon semiconductor wafer; (b) providing an underfill material on a dicing support tape, in which the underfill material is precut to the shape of the semiconductor wafer; (c) aligning the underfill material on the dicing support tape with the semiconductor wafer and laminating the underfill material to the semiconductor wafer.Type: GrantFiled: March 13, 2013Date of Patent: June 7, 2016Assignee: Henkel IP & Holding GmbHInventors: Gina Hoang, YounSang Kim, Rose Guino
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Patent number: 9305892Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.Type: GrantFiled: May 1, 2014Date of Patent: April 5, 2016Assignees: HENKEL AG & CO. KGAA, HENKEL IP & HOLDING GMBHInventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
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Publication number: 20160079187Abstract: Provided herein are multilayer structures having a reduced propensity to warp upon curing of certain components thereof. In one aspect, there are provided multilayer assemblies comprising a plurality of the above-described multilayer structures. In another aspect, there are provided methods for reducing wafer warpage upon cure of molding compositions applied thereto. In yet another aspect, there are provided methods for preparing wafers having substantially no warpage upon cure thereof.Type: ApplicationFiled: November 30, 2015Publication date: March 17, 2016Inventors: Tadashi Takano, Gina Hoang
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Patent number: 9281182Abstract: A method for preparing a semiconductor with preapplied underfill comprises providing a semiconductor wafer with a plurality of metallic bumps on its top side and, optionally, through-silica-vias vertically through the silicon wafer; laminating a back grinding tape to the top of the wafer covering the metallic bumps and through silicon vias; thinning the back side of the wafer; mounting a dicing tape to the back side of the thinned wafer and mounting the silicon wafer and dicing tape to a dicing frame; removing the back grinding tape; providing an underfill material precut into the shape of the wafer; aligning the underfill on with the wafer and laminating the underfill to the wafer.Type: GrantFiled: March 13, 2013Date of Patent: March 8, 2016Assignee: HENKEL IP & HOLDING GMBHInventors: YounSang Kim, Gina Hoang, Rose Guino
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Patent number: 9200184Abstract: A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater.Type: GrantFiled: March 15, 2013Date of Patent: December 1, 2015Assignee: HENKEL IP & HOLDING GMBHInventors: Junbo Gao, Gina Hoang
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Publication number: 20140242757Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.Type: ApplicationFiled: May 1, 2014Publication date: August 28, 2014Applicants: HENKEL IP & HOLDING GMBH, HENKEL JAPAN LIMITEDInventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
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Publication number: 20140057411Abstract: This invention is a method for singulating a semiconductor wafer into individual semiconductor dies, the top surface of the semiconductor wafer bumped with metallic pre-connections and having a coating of underfill disposed over and around the metallic pre-connection bumps. The method comprises (A) providing a semiconductor wafer having a top surface with an array of metallic pre-connection bumps and a coating of underfill disposed over and around the metallic pre-connection bumps; (B) dicing through the underfill between the metallic pre-connection bumps and into the top surface of the semiconductor wafer to the ultimate desired wafer thickness, creating dicing lines; and (C) removing wafer material from the backside of the wafer at least to the depth of the dicing lines, thus singulating the resulting dies from the wafer.Type: ApplicationFiled: October 31, 2013Publication date: February 27, 2014Applicant: HENKEL US IP LLCInventors: Gina Hoang, YounSang Kim, Rosette Guino, Qiaohong Huang
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Publication number: 20130306916Abstract: A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater.Type: ApplicationFiled: March 15, 2013Publication date: November 21, 2013Applicant: Henkel CorporationInventors: Junbo Gao, Gina Hoang
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Patent number: 8378017Abstract: The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.Type: GrantFiled: December 14, 2006Date of Patent: February 19, 2013Assignee: Designer Molecules, Inc.Inventors: Stephen M. Dershem, Gina Hoang, Melin Lu
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Publication number: 20070155869Abstract: The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.Type: ApplicationFiled: December 14, 2006Publication date: July 5, 2007Inventors: Stephen M. Dershem, Gina Hoang, Melin Lu
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Patent number: 6750301Abstract: Adhesive compositions containing a base compound or resin and an epoxy compound or resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications.Type: GrantFiled: July 7, 2000Date of Patent: June 15, 2004Assignee: National Starch and Chemical Investment Holding CorporationInventors: Mark R. Bonneau, Yun K. Shin, Gina Hoang, Martin Sobczak