Patents by Inventor Giora J. Dishon

Giora J. Dishon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of building solder bumps
    Patent number: 4950623
    Abstract: The invention is a method of forming a solder bump on an under bump metallurgy in which a contact pad on a substrate material is partially covered by a passivation layer upon the substrate material which is non-wettable by solder and in which the under bump metallurgy covers the portions of the contact pad which are not covered by the passivation layer and in which the under bump metallurgy overlaps from the contact pad to cover portions of the passivation layer.
    Type: Grant
    Filed: August 2, 1988
    Date of Patent: August 21, 1990
    Assignee: Microelectronics Center of North Carolina
    Inventor: Giora J. Dishon