Abstract: An electrical connector for connecting to an array of surface contacts includes a connector body and a plurality of cable terminators. The connector body defines an interior volume and includes an external surface defining a plurality of cable openings each configured to receive a respective multi-conductor cable therethrough and a plurality of passageways. The plurality of cable terminators are each configured to couple with a respective multi-conductor cable exiting the second section of a respective passageway. Each cable terminator includes a plurality of pins each configured to couple with a respective conductor of the multi-conductor cable and to extend to a respective contact surface. The contact surfaces of the plurality of cable terminators extend to a second plane. The first plane and the second plane are coplanar when the array is in the connection position.

Abstract: In one embodiment, an apparatus includes an optical module, and a heat sink for attachment to an optical module cage configured for receiving the optical module, the heat sink having a surface in which recesses are formed. The optical module includes a thermal interface material attached to a surface of the optical module for thermal contact with the heat sink, and lifting elements extending from the surface. The lifting elements are configured to create a gap between the thermal interface material and the heat sink during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, and are positioned for insertion into aligned recesses in the heat sink when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the heat sink and the thermal interface material.

Abstract: A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of a pluggable module within the enclosure when the pluggable module is inserted within the opening at the first end of the cage.

Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

Abstract: A system includes a cage and a first coil. The cage includes a first end and a second end opposite the first end. The first end is arranged to receive an electrical connector. The second end is arranged to receive a pluggable module such that the electrical connector forms an electrical connection with the pluggable module. The first coil is positioned on or in the cage such that the first coil is arranged to deliver electric power to the pluggable module by inducing an electric current in a second coil positioned in or on the pluggable module when the pluggable module is connected to the electrical connector in the cage.

Abstract: A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of an optical module within the enclosure when the optical module is inserted within the opening at the first end of the cage.

Abstract: An electrical connector for connecting to an array of surface contacts includes a connector body and a plurality of cable terminators. The connector body defines an interior volume and includes an external surface defining a plurality of cable openings each configured to receive a respective multi-conductor cable therethrough and a plurality of passageways. The plurality of cable terminators are each configured to couple with a respective multi-conductor cable exiting the second section of a respective passageway. Each cable terminator includes a plurality of pins each configured to couple with a respective conductor of the multi-conductor cable and to extend to a respective contact surface. The contact surfaces of the plurality of cable terminators extend to a second plane. The first plane and the second plane are coplanar when the array is in the connection position.

Abstract: A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of an optical module within the enclosure when the optical module is inserted within the opening at the first end of the cage.

Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

Abstract: In one embodiment a method includes receiving a constant bit rate data stream, segmenting the constant bit rate data stream into fixed size blocks of data, generating a time stamp indicative of a system reference clock, the time stamp being in reference to a clock rate of the constant bit rate data stream, encapsulating, in an electronic communication protocol frame, a predetermined number of fixed blocks of data along with (i) a control word indicative of, at least, a relative sequence of the predetermined number of fixed blocks of data in the constant bit rate stream and (ii) the time stamp, and transmitting the electronic communication protocol frame to a packet switched network.

Abstract: Various example embodiments are disclosed. According to an example embodiment, a form factor adapter module may include a small form factor (SFF) host connector configured to receive a small form factor pluggable (SFP or SFP+) module and to transmit and receive data according to a Serializer-deserializer Framer Interface (SFI) protocol. The form factor adapter module may also include a 10 Gigabit Ethernet Small Form-Factor Pluggable (XFP) edge finger connector configured to transmit and receive data to and from the SFF host connector according to the SFI protocol and to mate with an XFP edge finger socket.

Abstract: Various example embodiments are disclosed. According to an example embodiment, a form factor adapter module may include a small form factor (SFF) host connector configured to receive a small form factor pluggable (SFP or SFP+) module and to transmit and receive data according to a Serializer-deserializer Framer Interface (SFI) protocol. The form factor adapter module may also include a 10 Gigabit Ethernet Small Form-Factor Pluggable (XFP) edge finger connector configured to transmit and receive data to and from the SFF host connector according to the SFI protocol and to mate with an XFP edge finger socket.

Abstract: A system for releasing an optical connector adapter from an optical connector is disclosed. The adapter has a longitudinal opening extending therethrough and is configured for joining two optical connectors positioned within the opening. The connector has a locking member configured for locking engagement with the adapter. The system includes a block configured for connection to an equipment panel. The block has an opening extending therethrough and is sized for receiving the optical connector adapter and an internal optical connector having an optical line extending into an interior side of the panel. The system further includes a release mechanism movably mounted within the block between a closed position in which the internal optical connector is in locking engagement with the adapter and an open position in which the adapter is released from locking engagement with the internal optical connector.