Abstract: For manufacturing an integrated electronic device, a protection layer, of a first material, is formed over a body having a non-planar surface; a first dielectric layer, of a second material, is formed over the protection layer, the second material being selectively etchable with respect to the first material; an intermediate layer, of a third material, is formed over the first dielectric layer, the third material being selectively etchable with respect to the second material; a second dielectric layer, of a fourth material, is formed over the intermediate layer, the fourth material being selectively etchable with respect to the third material; vias are formed through the second dielectric layer, the intermediate layer, the first dielectric layer, and the protection layer; and electrical contacts, of conductive material, are formed in the vias.

Abstract: A modular apparatus for data communication between a distribution network and a residential network is disclosed. The apparatus has a first device adapted to interface a distribution network, at least one second device adapted to interface a residential network and to be mechanically and electrically connected to the first device, and at least one interconnecting lock adapted to keep the first device and the at least one second device firmly secured to each other and to activate electrical supply between the first device and the at least one second device.

Abstract: A modular apparatus for data communication between a distribution network and a residential network is disclosed. The apparatus has a first device adapted to interface a distribution network, at least one second device adapted to interface a residential network and to be mechanically and electrically connected to the first device, and at least one interconnecting lock adapted to keep the first device and the at least one second device firmly secured to each other and to activate electrical supply between the first device and the at least one second device.