Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

Abstract: A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

Abstract: A printed wiring board assembly is formed by mounting an insert having a pocket containing one or more standoffs in the cavity of a pallet. The pallet and the insert are both coupled to the bottom of a printed wiring board. A device having tinned leads and a tinned casing is positioned in the pocket of the insert above the standoffs. A solder preform is positioned in the pocket of insert, beneath the casing of the device. The assembly is placed in a soldering oven and heated to a at least a reflow temperature of the solder preform, whereby the device casing is joined to the insert and the device leads are coupled to solder pads on the printed wiring board.

Abstract: A face plate assembly includes a ground clip that is mounted to a face plate which is coupled to a circuit pack. The ground clip includes a base member, a contact surface and a free end. The ground clip is mounted to a flange provided on the faceplate. The flange includes a cutout, wherein the free end of the ground clip is received in the cutout for preventing rotation of the ground clip. The ground clip may include a first elbow connecting the base to the contact surface and a second elbow connecting the contact surface to the free end. A Z-bend may also be provided in the contact surface of ground clip.

Abstract: A fixture assembly for securing a component to a heat sink includes a frame having two parallel longitudinal members connected by first and second transverse crossbeams, which together define a receptacle into which a component is received. A spring clip is rotatably attached to the frame and has a position in which the spring clip presses the component against a heat sink. The frame includes at least two depending legs for supporting the frame above the surface of a heat sink, and at least one opening for receiving a fastener that secures the frame to the heat sink. A guide peg or similar positioning structure may also be provided for positioning the frame on the heat sink. The spring clip includes a proximal end having a non-round cross section which is rotatably attached to the first transverse crossbeam of the frame, and a distal end which includes a resilient lip which is detachably engage able with the second transverse crossbeam.

Abstract: A tab (22) at the edge of a panel (10) may be advantageously sheared by transporting the panel into an in-line shear (30). As the panel is transported into the shear, an adjustable rail (52) engages the tab (22) to guide the panel to maintain its orientation. The rail (52) is adjusted after the tab (22) has been sheared to now engage the panel (10) along its edge formed by the removal of the tab. In this way, the rail (52) can guide the panel upon transport from the shear.