Abstract: A method for applying markings to substrate surfaces by means of a transfer method, whereby a transfer layer located on a pre-printed release carrier film is transferred from the film onto the substrate surface, creating an adhesive image which has to be destroyed to be removed. The transfer layer comprises at least one RFD module comprising of an RFD chip and an antenna which is printed onto the release carrier film. Preferably, the RFD module is applied to a covering film sheet that can be removed from the release carrier film during transfer, and can be stuck to the substrate surface in an air-tight and water-tight manner after the transfer.

Abstract: A method for applying markings to substrate surfaces by means of a transfer method, whereby a transfer layer located on a pre-printed release carrier film is transferred from the film onto the substrate surface, creating an adhesive image which has to be destroyed to be removed. The transfer layer comprises at least one RFD module comprising of an RFD chip and an antenna which is printed onto the release carrier film. Preferably, the RFD module is applied to a covering film sheet that can be removed from the release carrier film during transfer, and can be stuck to the substrate surface in an air-tight and water-tight manner after the transfer.