Patents by Inventor Giuliano Martinelli

Giuliano Martinelli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Spectral Splitting-Based Radiation Concentration Photovoltaic System
    Publication number: 20080149162
    Abstract: A spectral splitting-based radiation concentration photovoltaic system is described, comprising one or more spectral splitting reflector elements, a photovoltaic concentrator, and a photovoltaic receiver.
    Type: Application
    Filed: April 7, 2006
    Publication date: June 26, 2008
    Inventors: Giuliano Martinelli, Marco Stefancich, Andrea Antonini
  • Silicon semiconductor wafer solar cell and process for producing said wafer
    Patent number: 5702538
    Abstract: A silicon semiconductor wafer is constructed from three mutually inclined monocrystalline regions (6, 7, 8) which form three circular sectors of the wafer whose interfaces and boundary lines consequently extend radially with respect to one another and form angles (W6, W7, W8) of less than 180.degree. with one another. In this arrangement, two of the interfaces are first-order twin grain boundaries between two <111> crystal planes in each case. The silicon semiconductor wafer is used to produce inexpensive high-performance solar cells.
    Type: Grant
    Filed: June 14, 1996
    Date of Patent: December 30, 1997
    Assignee: Siemens Solar GmbH
    Inventors: Arthur Endros, Giuliano Martinelli
  • Method for processing thin wafers and solar cells of crystalline silicon
    Patent number: 5650363
    Abstract: Thin semiconductor wafers and components manufactured therefrom, for instance solar cells of crystalline silicon, are subject to an increased breakage risk because of the brittle nature of the material and require a minimum thickness for the wafer in order to assure reliable handling. For improving the handling, a semiconductor wafer is provided surface-wide with a mechanical protective layer and this semiconductor wafer is subsequently subjected to a shaping treatment.
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: July 22, 1997
    Assignee: Siemens Aktiengesellschaft
    Inventors: Arthur Endroes, Karl-Heinz Eisenrith, Giuliano Martinelli