Patents by Inventor Glen Hillier

Glen Hillier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for fabricating thin film III-V compound solar cell
    Patent number: 11901476
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: February 13, 2024
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
  • METHODS FOR FABRICATING THIN FILM III-V COMPOUND SOLAR CELL
    Publication number: 20210328093
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Application
    Filed: February 8, 2021
    Publication date: October 21, 2021
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
  • Methods for fabricating thin film III-V compound solar cell
    Patent number: 10923617
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: February 16, 2021
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
  • METHODS FOR FABRICATING THIN FILM III-V COMPOUND SOLAR CELL
    Publication number: 20110318866
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film compound solar cell before it is separated from the substrate. To separate the thin film compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film compound solar cell.
    Type: Application
    Filed: June 21, 2011
    Publication date: December 29, 2011
    Applicant: MICROLINK DEVICES, INC.
    Inventors: Noren PAN, Glen HILLIER, Duy Phach VU, Rao TATAVARTI, Christopher YOUTSEY, David MCCALLUM, Genevieve MARTIN
  • Methods for fabricating thin film III-V compound solar cell
    Patent number: 7994419
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: August 9, 2011
    Assignee: MicroLink Devices, Inc.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
  • METHODS FOR FABRICATING THIN FILM III-V COMPOUND SOLAR CELL
    Publication number: 20090044860
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Application
    Filed: July 3, 2008
    Publication date: February 19, 2009
    Applicant: MicroLink Devices, Inc.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum
  • THIN FILM III-V COMPOUND SOLAR CELL
    Publication number: 20090038678
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Application
    Filed: July 3, 2008
    Publication date: February 12, 2009
    Applicant: MicroLink Devices, Inc.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum