Abstract: A chip stack comprising a flex circuit including a flex substrate having a first conductive pattern disposed thereon and a plurality of leads extending therefrom. Also included in the chip stack are at least two integrated circuit chip packages. The integrated circuit chip packages may be electrically connected to the first conductive pattern of the flex circuit such that the integrated circuit chip packages are positioned upon respective ones of opposed top and bottom surfaces of the flex substrate.

Abstract: A chip stack comprising a flex circuit including a flex substrate having a first conductive pattern disposed thereon and a plurality of leads extending therefrom. Also included in the chip stack are at least two integrated circuit chip packages. The integrated circuit chip packages may be electrically connected to the first conductive pattern of the flex circuit such that the integrated circuit chip packages are positioned upon respective ones of opposed top and bottom surfaces of the flex substrate. Alternatively, one of the integrated circuit chip packages may be positioned upon the top surface of the flex substrate and electrically connected to the first conductive pattern, with the remaining integrated circuit chip package being attached in a non-conductive manner to the bottom surface of the flex substrate such that the conductive contacts of such integrated circuit chip package and the leads collectively define a composite footprint for the chip stack.

Abstract: A module is provided for imparting wireless functionality to a host device. Software running on an application processor of the module can facilitate data exchange between the host device and a wireless radio of the module by converting data between a host-oriented protocol and a wireless protocol, thereby providing the host device with network connectivity. A configuration of the module can be changed by various command-based methods. Alternatively, the configuration can be changed by software running on a remote device in communication with the module over a wireless link. Flash memory can also be provided for storing the module configuration. Authentication can also be implemented to secure against the execution of unauthorized commands issued to the module. The module can allow for browser-based or command-based data exchange between the remote device and the host device over the wireless link.

Abstract: A method of rinsing an electronic substrate recognizes that adding a buffer to a rinsing fluid eliminates fluctuations in the amount of residues on an electronic substrate, and a buffered rinsing fluid is prepared by (a) providing water from a water source; (b) deionizing the water to produce deionized water; (c) adding a buffer to the deionized water at a concentration effective to eliminate fluctuations in the amount of residues on the electronic substrate. The electronic substrate is rinsed with the buffered rinsing fluid.

Abstract: A worktable that can be used to support a substrate while forming a hole therein. The worktable may include one or more actuators that stretch the substrate. The worktable may also have a control unit that is connected to the actuators and strain gauges that sense the strain in the substrate. The control unit, actuators and strain gauges may provide a closed loop control system for tensioning the substrate. The center portion of the substrate may be supported by wires that extend across an opening in the worktable. The opening eliminates a backing surface that may interfere with a laser hold forming process.

Abstract: A worktable that can be used to support a substrate while forming a hole therein. The worktable may include one or more actuators that stretch the substrate. The worktable may also have a control unit that is connected to the actuators and strain gauges that sense the strain in the substrate. The control unit, actuators and strain gauges may provide a closed loop control system for tensioning the substrate. The center portion of the substrate may be supported by wires that extend across an opening in the worktable. The opening eliminates a backing surface that may interfere with a laser hold forming process.

Abstract: A method of rinsing an electronic substrate recognizes that adding a buffer to a rinsing fluid eliminates fluctuations in the amount of residues on an electronic substrate, and a buffered rinsing fluid is prepared by (a) providing water from a water source; (b) deionizing the water to produce deionized water; (c) adding a buffer to the deionized water at a concentration effective to eliminate fluctuations in the amount of residues on the electronic substrate. The electronic substrate is rinsed with the buffered rinsing fluid.

Abstract: Methods and apparatus are provided which decrease the amount of movement likely to occur during processing of a substrate. In particular, a horizontally supported dielectric panel is subjected to a series of processing steps during which the panel is heated, cooled, or maintained at a fixed temperature so as to a achieve a 2 to 1 reduction in material movement during subsequent processing. It is contemplated that application of the disclosed methods to a dielectric panel will be particularly beneficial when application is accomplished prior to laser drilling and sputtering the panel.

Abstract: An automated tool that can handle a sheet. The tool may include a flexible membrane that is attached to a frame. The flexible membrane may include a vacuum opening that is adapted to pull the sheet into the membrane. The vacuum opening may pull the outer edges of the sheet out of a tray when the membrane is deflected to a flat position. The tool may then move away from the tray wherein the outer edges of the membrane and sheet are pulled from an adjacent sheet. This effectively “peels” the sheet out of the tray.

Abstract: The use of ion beam processing in preparation of a substrate's surfaces, particularly a polyimide film such as Upilex®-SS, prior to depositing a metal on the substrate surfaces. In one aspect, the ion beam processing can be used to remove relatively unique forms of surface contaminants without requiring additional cleaning by traditional methods such as chemical or plasma cleaning. In another aspect, the ion beam processing utilizing an anode layer ion source can be used to prepare polyimide films prior to metal deposition to produce substrates having surprisingly good peel strengths. In still another aspect, ion beam processing can be used to minimize differences in surface characteristics between opposite sides of a substrate.

Abstract: A method for coating substrates having sides of the substrate with unequal adhesion properties includes the steps of non-symmetrically coating the substrate by coating a first side under a first set of coating conditions and coating a second side under a second set of operating conditions wherein the operating conditions used to coat each side are varied so as to compensate for the unequal adhesion properties of the sides.

Abstract: A method for coating substrates having sides of the substrate with unequal adhesion properties includes the steps of non-symmetrically coating the substrate by coating a first side under a first set of coating conditions and coating a second side under a second set of operating conditions wherein the operating conditions used to coat each side are varied so as to compensate for the unequal adhesion properties of the sides.