Abstract: An integrated circuit product package configured to continuity testing is described. The integrated circuit product package includes a package substrate. The package substrate includes internal routing connections. The integrated circuit product package also includes a semiconductor die coupled to the package substrate. The semiconductor die includes input/output (I/O) pins and switches. The switches selectively coupled the I/O pins to facilitate a daisy chain connection. The daisy chain connection includes circuitry fabricated on the semiconductor die, more than two of the internal routing connections, more than two of the I/O pins and at least one switch.

Abstract: An integrated circuit product package configured to continuity testing is described. The integrated circuit product package includes a package substrate. The package substrate includes internal routing connections. The integrated circuit product package also includes a semiconductor die coupled to the package substrate. The semiconductor die includes input/output (I/O) pins and switches. The switches selectively coupled the I/O pins to facilitate a daisy chain connection. The daisy chain connection includes circuitry fabricated on the semiconductor die, more than two of the internal routing connections, more than two of the I/O pins and at least one switch.

Abstract: A first apparatus, such as a die or a semiconductor package, has signal paths extending through the apparatus. The signal paths can include through vias and other components. The signal paths are operable to communicate with a second apparatus when the second apparatus is stacked with the first apparatus. The first apparatus also has pass gates. Each pass gate is configurable in response to a signal, to short a pair of the signal paths to enable substantially simultaneous testing of the signal paths. The pass gates may be configurable to isolate the signal paths during operation of the first apparatus.