Abstract: An optical signal transceiver subassembly is mounted on a lead frame for further attachment to an electronic printed circuit board. The optical subassembly is comprised of a solid-state laser, a pair of photo-detectors, an over-mold of transparent material having shapes forming the exposed surface thereof, the surface and a selective silvering of a portion thereof defining a beam-splitter mirror and an interior reflective focusing surface, preferably in the shape of a partial cylindrical surface. The beam-splitter mirror is lightly silvered and the cylindrical surface is silvered to enhance the reflection of the laser beam. The optical subassembly is further enclosed with a housing incorporating a pair of lenses and alignment pins. The lenses focus the data stream of optical light signals onto the end of the outgoing optical fiber and the data stream of optical light signals from the incoming optical fiber onto and through the beam-splitter and onto a first photo-detector.

Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Abstract: An optical coupler includes a first plate and a second plate superposed over the first plate. At least the second plate has at least one groove formed therein. The at least one groove extends continuously from one edge of the second plate to another edge of the second plate. An optical fiber is disposed in the at least one groove.

Abstract: An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one active region. The optical transceiver arrangement further includes at least one optical coupler disposed within the housing for optically coupling the at least one active region to the fiber optic cable. The optical transceiver arrangement also includes a laminate assembly having the retainer assembly disposed thereon. The die chip is electrically coupled to the laminate assembly.

Abstract: The present disclose provides methods and systems for positioning a fiber end of an optical fiber. A block is provided having an opening for receiving the optical fiber. The optical fiber is positioned in the opening to constrain the optical fiber in at least one direction. The optical fiber has a first portion with a free end which is cantilevered or extends from the block. The optical fiber is moved against the at least one direction which is constrained. The movement is provided from a position on a second portion of the optical fiber, which is opposite the first portion relative to the block. This movement causes a lateral displacement of the free end.

Abstract: A coupling arrangement includes a vertical cavity surface emitting laser. A carrier has the vertical cavity surface emitting laser affixed thereto. An optical coupler is coupled to the vertical cavity surface emitting laser, and has a plurality of optical fibers which receive light emitted from the vertical cavity surface emitting laser. The vertical cavity surface emitting laser is separated from the optical coupler by a gap and is free of direct contact with the optical coupler. The gap is less than about 50 microns, and is greater than zero microns. A curable adhesive is disposed in the gap for coupling the vertical cavity surface emitting laser to the optical coupler. The adhesive has a viscosity that defines a size of the gap.

Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Abstract: The present disclose provides methods and systems for positioning a fiber end of an optical fiber. A block is provided having an opening for receiving the optical fiber. The optical fiber is positioned in the opening to constrain the optical fiber in at least one direction. The optical fiber has a first portion with a free end which is cantilevered or extends from the block. The optical fiber is moved against the at least one direction which is constrained. The movement is provided from a position on a second portion of the optical fiber, which is opposite the first portion relative to the block. This movement causes a lateral displacement of the free end.

Abstract: An optical coupler includes a first plate and a second plate superposed over the first plate. At least the second plate has at least one groove formed therein. The at least one groove extends continuously from one edge of the second plate to another edge of the second plate. An optical fiber is disposed in the at least one groove.

Abstract: An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one active region. The optical transceiver arrangement further includes at least one optical coupler disposed within the housing for optically coupling the at least one active region to the fiber optic cable. The optical transceiver arrangement also includes a laminate assembly having the retainer assembly disposed thereon. The die chip is electrically coupled to the laminate assembly.

Abstract: An optical signal transceiver subassembly is mounted on a lead frame for further attachment to an electronic printed circuit board. The optical subassembly is comprised of a solid-state laser, a pair of photo-detectors, an over-mold of transparent material having shapes forming the exposed surface thereof, the surface and a selective silvering of a portion thereof defining a beam-splitter mirror and an interior reflective focusing surface, preferably in the shape of a partial cylindrical surface. The beam-splitter mirror is lightly silvered and the cylindrical surface is silvered to enhance the reflection of the laser beam. The optical subassembly is further enclosed with a housing incorporating a pair of lenses and alignment pins. The lenses focus the data stream of optical light signals onto the end of the outgoing optical fiber and the data stream of optical light signals from the incoming optical fiber onto and through the beam-splitter and onto a first photo-detector.

Abstract: Parallel optical coupling apparatus for coupling a connector attached to one end of a parallel optical cable to a receiver or transmitter array. A parallel fiber optic assembly includes a receiver or transmitter array subassembly that houses a parallel optical coupler for transferring optical signals from an array of sources (e.g., lasers) in the assembly to the connector, or from the connector to an array of receiving elements in the assembly. A connector shell is provided that properly aligns the connector with respect to the optical coupler array.

Abstract: The invention is a radiofrequency identification tag comprising a semiconductor chip having radio frequency, logic, and memory circuits, and an antenna that are mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination are sealed with an organic film covering.

Abstract: An optical coupler. The coupler has an optical element for transferring an optical signal from an entrance region, external to the optical unit, to an exit region, also external to the optical unit. The coupling element has a first substantially planar transmitting surface lying in a first plane, a second substantially planar transmitting surface lying in a second plane not coplanar with the first plane, a first substantially planar reflecting surface substantially perpendicular to the first transmitting surface, and a second substantially planar reflecting surface substantially parallel to the first reflecting surface, and a shaped reflecting surface substantially perpendicular to and adjoining the first and second reflecting surfaces.

Abstract: The invention is a radiofrequency identification tag comprising a semiconductor chip having radio frequency, logic, and memory circuits, and an antenna that are mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination are sealed with an organic film covering.

Abstract: Parallel optical coupling apparatus for coupling a connector attached to one end of a parallel optical cable to a receiver or transmitter array. A parallel fiber optic assembly includes a receiver or transmitter array subassembly that houses a parallel optical coupler for transferring optical signals from an array of sources (e.g., lasers) in the assembly to the connector, or from the connector to an array of receiving elements in the assembly. A connector shell is provided that properly aligns the connector with respect to the optical coupler array.

Abstract: A radiofrequency identification tag has a semiconductor chip with radio frequency circuit, logic, memory circuits, and further includes an antenna that is mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination can be sealed with an organic film covering.